
| Type | Description | ||
|---|---|---|---|
| RoHS Status | RoHS Compliant | Part Life Cycle Code | Transferred |
| Package Description | FCBGA-784 | Reach Compliance Code | compliant |
| ECCN Code | 5A002.A.4 | HTS Code | 8542.39.00.01 |
| Factory Lead Time | 52 Weeks | JESD-30 Code | R-PBGA-B784 |
| JESD-609 Code | e1 | Moisture Sensitivity Level | 4 |
| Number of Terminals | 784 | Operating Temperature-Max | 100 °C |
| Operating Temperature-Min | -40 °C | Package Body Material | PLASTIC/EPOXY |
| Package Code | BGA | Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY | Peak Reflow Temperature (Cel) | 250 |
| Supply Voltage-Max | 0.876 V | Supply Voltage-Min | 0.825 V |
YG GROUP supports reliable sourcing through quality controls and compliance documentation. Please confirm product requirements, applicable certifications and supporting documents before ordering.
XCZU2EG-2SFVC784I is an authentic electronic component manufactured by Xilinx, categorized under Microcontrollers - MCU. It is supplied in the standard manufacturer-specified package footprint, providing industry-standard mechanical dimensions and terminal configurations for board-level assembly. Full pinout configurations, physical footprint drawings, and rated operating tolerances are documented in the official XCZU2EG-2SFVC784I datasheet above.
Electronic component spot-market pricing for XCZU2EG-2SFVC784I fluctuates based on real-time global availability, production date codes, minimum order quantities (MOQ), and packaging formats (e.g., Reel, Tube, Tray). Using an RFQ ensures you receive accurate, real-time volume pricing tied to verified, traceable inventory rather than stale catalog estimates.
Lead times for XCZU2EG-2SFVC784I depend on whether stock is dispatched from our central hub or regional franchise partners. Ready-to-ship inventory typically leaves the warehouse within 1–3 business days following quality inspection, while factory-direct or back-ordered allocations are confirmed with an estimated ship date upon RFQ reply.
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