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  1. Home
  2. /Products
  3. /Embedded Processors & Controllers
  4. /FPGA - Field Programmable Gate Array
  5. /XCVC1902-2MSIVA2892I
XCVC1902-2MSIVA2892I thumbnail 1
Xilinx

XCVC1902-2MSIVA2892I

Category
FPGA - Field Programmable Gate Array
Manufacturer
XilinxDetails
RoHS Status
Production Status
Active
Package
1596-BFBGA, FCBGA
Datasheet
Description
The part number XCVC1902-2MSIVA2892I represents a high-end Versal™ AI Core series Adaptive Compute Acceleration Platform (ACAP / Adaptive SoC) manufactured by AMD (formerly Xilinx). This specific part number is a specialized/large-package variant tailored for artificial intelligence, machine learning, and high-performance computing.
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Quality Control
Authentic & Traceable
Shipping (In-stock)
1-3 business days
Quote Response
Within 24 Hours
Stock Status2070
QuantityXCVC1902-2MSIVA2892I
Country

Get Tiered Pricing (Submit RFQ)

Product Details
Documentations
🔍 Part Number Breakdown
  • XC: Xilinx standard commercial/industrial prefix.
  • VC: Represents the Versal™ series adaptive platform.
  • 1902: Specifies the chip architecture and resource size. Within the AI Core series, the 1902 boasts massive hardware resources:
    • Integrates approximately 1.9M (1.9 million) Logic Cells.
    • Features dedicated AI Engines for AI computing acceleration.
    • Hardcore processors: Dual-core ARM® Cortex®-A72 and dual-core ARM® Cortex®-R5F.
  • -2: Speed grade. Indicates a medium-to-high performance level (typically ranged from -1 to -3, where higher numbers indicate faster performance).
  • M: Voltage and power consumption characteristic.
  • SI: Denotes a high-reliability, special-purpose, or security-enhanced sub-series design.
  • VA2892: Package designator.
    • This is a specialized 2892-pin FCBGA (55mm x 55mm) large package. compared to the more common 1596 or 2197 packages, the 2892 package provides more I/O pins and a larger surface area for thermal dissipation. It is typically used in custom-grade hardware boards requiring high-bandwidth and multi-channel data exchange.
  • I: Temperature grade. Stands for Industrial, supporting an operational junction temperature range of -40°C to 100°C.
🚀 Core Hardware Features
  • Heterogeneous Compute Cores: Combines traditional programmable logic (FPGA fabric) with hardened ARM processor clusters and dedicated AI Engines designed for vector and matrix operations.
  • Advanced Connectivity: Features integrated hardened PCIe blocks, DDR memory controllers, DMA channels, and a highly configurable Network-on-Chip (NoC).
  • Target Applications: This chip is primarily deployed in scenarios with extreme demands for computing power and data throughput, such as 5G wireless infrastructure, high-level autonomous driving domain controllers (ADAS), data center acceleration cards, and high-end industrial machine vision systems.
Certified Quality & Compliance
Purchase & Inquiry
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YG GROUP supports reliable sourcing through quality controls and compliance documentation. Please confirm product requirements, applicable certifications and supporting documents before ordering.

  • 1. Certification Scope: Quality certifications apply only to the entities, sites and activities listed in valid certificates. Management system certification does not certify each individual product.
  • 2. Product Authenticity: Products must match the agreed manufacturer, part number and condition. Supplier screening and authenticity checks help reduce counterfeit risk.
  • 3. Inspection & Testing: The inspection scope follows product risks and agreed requirements. Additional testing, laboratory arrangements, costs and lead times require written confirmation.
  • 4. Traceability & Documentation: Request conformity certificates, traceability records or test reports before ordering. Document availability, issuer and coverage must be confirmed for the offered goods.
  • 5. Environmental Compliance: RoHS and REACH information is based on applicable manufacturer documentation. Confirm the exact part, declaration date and relevant exemptions before ordering.
  • 6. Handling & Protection: Handling, storage and packaging follow applicable product requirements, including ESD and moisture protection where required. Special handling requirements must be agreed before ordering.
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Product FAQ
Purchasing FAQ

What type of component is XCVC1902-2MSIVA2892I, and what package does it use?

XCVC1902-2MSIVA2892I is an authentic electronic component manufactured by Xilinx, categorized under FPGA - Field Programmable Gate Array. It is supplied in the standard 1596-BFBGA, FCBGA package footprint, providing industry-standard mechanical dimensions and terminal configurations for board-level assembly. Full pinout configurations, physical footprint drawings, and rated operating tolerances are documented in the official XCVC1902-2MSIVA2892I datasheet above.

Why is pricing for XCVC1902-2MSIVA2892I available via RFQ rather than a fixed checkout price?

Electronic component spot-market pricing for XCVC1902-2MSIVA2892I fluctuates based on real-time global availability, production date codes, minimum order quantities (MOQ), and packaging formats (e.g., Reel, Tube, Tray). Using an RFQ ensures you receive accurate, real-time volume pricing tied to verified, traceable inventory rather than stale catalog estimates.

How quickly can XCVC1902-2MSIVA2892I be shipped once quoted?

Lead times for XCVC1902-2MSIVA2892I depend on whether stock is dispatched from our central hub or regional franchise partners. Ready-to-ship inventory typically leaves the warehouse within 1–3 business days following quality inspection, while factory-direct or back-ordered allocations are confirmed with an estimated ship date upon RFQ reply.

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