
| Type | Description | ||
|---|---|---|---|
| Part Life Cycle Code | Obsolete | Package Description | MODULE |
| Reach Compliance Code | compliant | JESD-30 Code | R-XXMA-N |
| Memory Density | 33776997205278 bit | Memory IC Type | FLASH MODULE |
| Memory Width | 8 | Number of Functions | 1 |
| Number of Words | 4222124650659 words | Number of Words Code | 3840000000000 |
| Operating Mode | ASYNCHRONOUS | Operating Temperature-Max | 70 °C |
| Organization | 3.84TX8 | Package Body Material | UNSPECIFIED |
| Package Code | XMA | Package Shape | RECTANGULAR |
| Package Style | MICROELECTRONIC ASSEMBLY | Surface Mount | YES |
| Technology | CMOS | Terminal Form | NO LEAD |
YG GROUP supports reliable sourcing through quality controls and compliance documentation. Please confirm product requirements, applicable certifications and supporting documents before ordering.
MTFDHBE3T8TDF-1AW1ZABYY is an authentic electronic component manufactured by Micron, categorized under NAND Flash. It is supplied in the standard manufacturer-specified package footprint, providing industry-standard mechanical dimensions and terminal configurations for board-level assembly. Full pinout configurations, physical footprint drawings, and rated operating tolerances are documented in the official MTFDHBE3T8TDF-1AW1ZABYY datasheet above.
Electronic component spot-market pricing for MTFDHBE3T8TDF-1AW1ZABYY fluctuates based on real-time global availability, production date codes, minimum order quantities (MOQ), and packaging formats (e.g., Reel, Tube, Tray). Using an RFQ ensures you receive accurate, real-time volume pricing tied to verified, traceable inventory rather than stale catalog estimates.
Lead times for MTFDHBE3T8TDF-1AW1ZABYY depend on whether stock is dispatched from our central hub or regional franchise partners. Ready-to-ship inventory typically leaves the warehouse within 1–3 business days following quality inspection, while factory-direct or back-ordered allocations are confirmed with an estimated ship date upon RFQ reply.
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