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  1. Home
  2. /Products
  3. /Memory ICs
  4. /Multichip Packages
  5. /W71N88AALRNIG
W71N88AALRNIG thumbnail 1
Winbond

W71N88AALRNIG

Category
Multichip Packages
Manufacturer
WinbondDetails
Datasheet
—
Description
W71N88AALRNIG is a Winbond W71N MCP product: Density Flash 8Gb, Density DRAM 8Gb, I/O Bus Flash 8, I/O Bus DRAM 16, Built-in ECC (bit) 8, Page Size (Byte) 4096, Spare Area (Byte) 256.
Similar Products
—
Quality Control
Authentic & Traceable
Shipping (In-stock)
1-3 business days
Quote Response
Within 24 Hours
Stock Status5060
QuantityW71N88AALRNIG
Country

Get Tiered Pricing (Submit RFQ)

Specification
Product Details
Key Features
Applications
TypeDescriptionTypeDescription
Density Flash8GbDensity DRAM8Gb
I/O Bus Flash8I/O Bus DRAM16
Built-in ECC (bit)8Page Size (Byte)4096
Spare Area (Byte)256DRAM TypeLPDDR4x
DRAM STR (Mhz)2133Flash Voltage (V)1.8
DRAM Voltage (V)1.8/1.1/0.6Temp (°C)-40~85
PKGVFBGA-149DIM8x9.5MM^2
Interface TypeONFI & LPDDR4xCarbon DataY
Industrial StatusPAutomotive StatusUD
LongevityNProduct SeriesW71N
Certified Quality & Compliance
Purchase & Inquiry
Secure Packaging
Shipping & Availability
Payment

YG GROUP (YUGUANG INTERNATIONAL(HK)CO.,LTD) supports reliable sourcing through quality controls and compliance documentation. Please confirm product requirements, applicable certifications and supporting documents before ordering.

  • 1. Certification Scope: Quality certifications apply only to the entities, sites and activities listed in valid certificates. Management system certification does not certify each individual product.
  • 2. Product Authenticity: Products must match the agreed manufacturer, part number and condition. Supplier screening and authenticity checks help reduce counterfeit risk.
  • 3. Inspection & Testing: The inspection scope follows product risks and agreed requirements. Additional testing, laboratory arrangements, costs and lead times require written confirmation.
  • 4. Traceability & Documentation: Request conformity certificates, traceability records or test reports before ordering. Document availability, issuer and coverage must be confirmed for the offered goods.
  • 5. Environmental Compliance: RoHS and REACH information is based on applicable manufacturer documentation. Confirm the exact part, declaration date and relevant exemptions before ordering.
  • 6. Handling & Protection: Handling, storage and packaging follow applicable product requirements, including ESD and moisture protection where required. Special handling requirements must be agreed before ordering.
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Product FAQ
Purchasing FAQ

What type of component is W71N88AALRNIG, and what package does it use?

W71N88AALRNIG is an authentic electronic component manufactured by Winbond, categorized under Multichip Packages. It is supplied in the standard manufacturer-specified package footprint, providing industry-standard mechanical dimensions and terminal configurations for board-level assembly. Full pinout configurations, physical footprint drawings, and rated operating tolerances are documented in the official W71N88AALRNIG datasheet above.

Why is pricing for W71N88AALRNIG available via RFQ rather than a fixed checkout price?

Electronic component spot-market pricing for W71N88AALRNIG fluctuates based on real-time global availability, production date codes, minimum order quantities (MOQ), and packaging formats (e.g., Reel, Tube, Tray). Using an RFQ ensures you receive accurate, real-time volume pricing tied to verified, traceable inventory rather than stale catalog estimates.

How quickly can W71N88AALRNIG be shipped once quoted?

Lead times for W71N88AALRNIG depend on whether stock is dispatched from our central hub or regional franchise partners. Ready-to-ship inventory typically leaves the warehouse within 1–3 business days following quality inspection, while factory-direct or back-ordered allocations are confirmed with an estimated ship date upon RFQ reply.

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