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  2. /Products
  3. /Memory ICs
  4. /Multichip Packages
  5. /W25M512JVFIQ
W25M512JVFIQ thumbnail 1
Winbond

W25M512JVFIQ

Category
Multichip Packages
Manufacturer
WinbondDetails
Datasheet
Description
W25M512JVFIQ is a Winbond W25M-JV SpiStack Combo Flash product: Memory Configuration 256Mb NOR +256Mb NOR, Density 512Mb, STR (MHz) 104, Voltage (V) 2.7~3.6, Temp (°C) -40~85, PKG SOP-16.
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Quality Control
Authentic & Traceable
Shipping (In-stock)
1-3 business days
Quote Response
Within 24 Hours
Stock Status5380
QuantityW25M512JVFIQ
Country

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Specification
Product Details
Key Features
Applications
Documentation
TypeDescriptionTypeDescription
Memory Configuration256Mb NOR +256Mb NORDensity512Mb
STR (MHz)104Voltage (V)2.7~3.6
Temp (°C)-40~85PKGSOP-16
DIM300MILInterface TypeSPI/Dual /Quad
Carbon DataYIndustrial StatusP
LongevityNConcurrent OperationYes
Boot256Mb NORAdd. SpecC2h, Default BUF=0, ECC=1
Product SeriesW25M-JV
Certified Quality & Compliance
Purchase & Inquiry
Secure Packaging
Shipping & Availability
Payment

YG GROUP supports reliable sourcing through quality controls and compliance documentation. Please confirm product requirements, applicable certifications and supporting documents before ordering.

  • 1. Certification Scope: Quality certifications apply only to the entities, sites and activities listed in valid certificates. Management system certification does not certify each individual product.
  • 2. Product Authenticity: Products must match the agreed manufacturer, part number and condition. Supplier screening and authenticity checks help reduce counterfeit risk.
  • 3. Inspection & Testing: The inspection scope follows product risks and agreed requirements. Additional testing, laboratory arrangements, costs and lead times require written confirmation.
  • 4. Traceability & Documentation: Request conformity certificates, traceability records or test reports before ordering. Document availability, issuer and coverage must be confirmed for the offered goods.
  • 5. Environmental Compliance: RoHS and REACH information is based on applicable manufacturer documentation. Confirm the exact part, declaration date and relevant exemptions before ordering.
  • 6. Handling & Protection: Handling, storage and packaging follow applicable product requirements, including ESD and moisture protection where required. Special handling requirements must be agreed before ordering.
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Product FAQ
Purchasing FAQ

What type of component is W25M512JVFIQ, and what package does it use?

W25M512JVFIQ is an authentic electronic component manufactured by Winbond, categorized under Multichip Packages. It is supplied in the standard manufacturer-specified package footprint, providing industry-standard mechanical dimensions and terminal configurations for board-level assembly. Full pinout configurations, physical footprint drawings, and rated operating tolerances are documented in the official W25M512JVFIQ datasheet above.

Why is pricing for W25M512JVFIQ available via RFQ rather than a fixed checkout price?

Electronic component spot-market pricing for W25M512JVFIQ fluctuates based on real-time global availability, production date codes, minimum order quantities (MOQ), and packaging formats (e.g., Reel, Tube, Tray). Using an RFQ ensures you receive accurate, real-time volume pricing tied to verified, traceable inventory rather than stale catalog estimates.

How quickly can W25M512JVFIQ be shipped once quoted?

Lead times for W25M512JVFIQ depend on whether stock is dispatched from our central hub or regional franchise partners. Ready-to-ship inventory typically leaves the warehouse within 1–3 business days following quality inspection, while factory-direct or back-ordered allocations are confirmed with an estimated ship date upon RFQ reply.

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