
| Type | Description | ||
|---|---|---|---|
| Memory Configuration | 1Gb NAND +1Gb NAND | Density | 2Gb |
| STR (MHz) | 104 | Voltage (V) | 2.7~3.6 |
| Temp (°C) | -40~105 | PKG | SON-8 |
| DIM | 8x6MM^2 | Interface Type | SPI/Dual /Quad |
| Carbon Data | Y | Automotive Status | P |
| Automotive Grade | AG2 | Longevity | Y |
| Longevity Date Start | 2017/05 | NAND Built-in ECC (bit) | 1 |
| Concurrent Operation | Yes | Default Read Mode | Continuous Read |
| Read Mode Option | Buffer Read | NAND Page Size (Byte) | 2048 |
| NAND Spare Area (Byte) | 64 | Boot | 1Gb serial NAND |
YG GROUP supports reliable sourcing through quality controls and compliance documentation. Please confirm product requirements, applicable certifications and supporting documents before ordering.
W25M02GVZEAT is an authentic electronic component manufactured by Winbond, categorized under Multichip Packages. It is supplied in the standard manufacturer-specified package footprint, providing industry-standard mechanical dimensions and terminal configurations for board-level assembly. Full pinout configurations, physical footprint drawings, and rated operating tolerances are documented in the official W25M02GVZEAT datasheet above.
Electronic component spot-market pricing for W25M02GVZEAT fluctuates based on real-time global availability, production date codes, minimum order quantities (MOQ), and packaging formats (e.g., Reel, Tube, Tray). Using an RFQ ensures you receive accurate, real-time volume pricing tied to verified, traceable inventory rather than stale catalog estimates.
Lead times for W25M02GVZEAT depend on whether stock is dispatched from our central hub or regional franchise partners. Ready-to-ship inventory typically leaves the warehouse within 1–3 business days following quality inspection, while factory-direct or back-ordered allocations are confirmed with an estimated ship date upon RFQ reply.
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