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支持 PD 的多快充协议双 C 口充电解决方案

I 2C High-efficiency Bidirectional Buck-Boost Charge-Discharge Controller

Power Device CE70H110DNDI Depletion Cascode DFN8*8 700V

Power Device CE65H270DNCI Depletion Cascode DFN5*6 650V

Power Device CE65H160DNCI Depletion Cascode DFN5*6 650V

Power Device CE65E300DNYI Enhancement Single DFN 5*6 650V

Power Device CE65E160DNYI Enhancement Single DFN 5*6 650V

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Ethernet Transceiver, QCC40, QFN-40

W25Q16JVSSIQ is a Winbond W25Q-JV QSPI NOR product: Density 16Mb, STR (MHz) 133, Voltage (V) 2.7~3.6, Temp (°C) -40~85, PKG SOP-8, DIM 208MIL, Interface Type SPI/Dual/Quad, Carbon Data Y.

The W25N01GVZEIG is a 1Gbit 3V Serial SLC NAND Flash memory manufactured by Winbond Electronics. Featuring 128MB storage capacity, SPI Serial NAND interface, Dual/Quad SPI buffer read and continuous read support, 104MHz clock operation, compact 8-WSON (8 × 6) package, and SLC NAND architecture, it is suitable for embedded data storage, firmware storage, boot support, OTA update storage, IoT devices, smart meters, industrial controllers, gateways, consumer electronics, communication modules, and compact processor-based systems. The W25N01GVZEIG provides Winbond QspiNAND storage performance for applications that need higher capacity than Serial NOR Flash while maintaining a low-pin-count serial interface.

W25Q25RVCFJQ is a Winbond W25Q-RV QSPI NOR product: Density 256Mb, STR (MHz) 133, Voltage (V) 2.7~3.6, Temp (°C) -40~105, PKG SOP-16, DIM 300MIL, Interface Type SPI/Dual/Quad.

W25Q12RVCSJQ is a Winbond W25Q-RV QSPI NOR product: Density 128Mb, STR (MHz) 166, Voltage (V) 2.7~3.6, Temp (°C) -40~105, PKG SOP-8, DIM 208MIL, Interface Type SPI/Dual/Quad, Carbon Data Y.

W25Q64RVCSJQ is a Winbond W25Q-RV QSPI NOR product: Density 64Mb, STR (MHz) 166, Voltage (V) 2.7~3.6, Temp (°C) -40~105, PKG SOP-8, DIM 208MIL, Interface Type SPI/Dual/Quad.

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