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  1. Home
  2. /Products
  3. /Integrated Circuits - ICs
  4. /Interface ICs
  5. /XCVU13P-3FHGB2104E
XCVU13P-3FHGB2104E thumbnail 1
Xilinx

XCVU13P-3FHGB2104E

Category
Interface ICs
Manufacturer
XilinxDetails
RoHS Status
Datasheet
—
Description
IC FPGA 702 I/O 2104FCBGA.Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC 702 514867200 3780000 2104-BBGA, FCBGA
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—
Quality Control
Authentic & Traceable
Shipping (In-stock)
1-3 business days
Quote Response
Within 24 Hours
Stock Status5430
QuantityXCVU13P-3FHGB2104E
Country

Get Tiered Pricing (Submit RFQ)

Specification
TypeDescriptionTypeDescription
SeriesVirtex® UltraScale+™PackagingTray
Part StatusActiveManufacturer Lead Time20 Weeks
Mounting TypeSurface MountNumber of I/O702
Number of LABs/CLBs216000Number of Logic Elements/Cells3780000
Operating Temperature0°C ~ 100°C (TJ)Package / Case2104-BBGA, FCBGA
Supplier Device Package2104-FCBGA (52.5x52.5)Total RAM Bits514867200
Voltage - Supply0.873V ~ 0.927VExportControlClassNumber5A002A1
HtsusCode8542.31.0060MoistureSensitivityLevel3 (168 Hours)
ReachStatusREACH UnknownRoHS StatusRoHS Compliant
Certified Quality & Compliance
Purchase & Inquiry
Secure Packaging
Shipping & Availability
Payment

YG GROUP supports reliable sourcing through quality controls and compliance documentation. Please confirm product requirements, applicable certifications and supporting documents before ordering.

  • 1. Certification Scope: Quality certifications apply only to the entities, sites and activities listed in valid certificates. Management system certification does not certify each individual product.
  • 2. Product Authenticity: Products must match the agreed manufacturer, part number and condition. Supplier screening and authenticity checks help reduce counterfeit risk.
  • 3. Inspection & Testing: The inspection scope follows product risks and agreed requirements. Additional testing, laboratory arrangements, costs and lead times require written confirmation.
  • 4. Traceability & Documentation: Request conformity certificates, traceability records or test reports before ordering. Document availability, issuer and coverage must be confirmed for the offered goods.
  • 5. Environmental Compliance: RoHS and REACH information is based on applicable manufacturer documentation. Confirm the exact part, declaration date and relevant exemptions before ordering.
  • 6. Handling & Protection: Handling, storage and packaging follow applicable product requirements, including ESD and moisture protection where required. Special handling requirements must be agreed before ordering.
ERAI
ISO 9001
ESD Control

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Product FAQ
Purchasing FAQ

What type of component is XCVU13P-3FHGB2104E, and what package does it use?

XCVU13P-3FHGB2104E is an authentic electronic component manufactured by Xilinx, categorized under Interface ICs. It is supplied in the standard manufacturer-specified package footprint, providing industry-standard mechanical dimensions and terminal configurations for board-level assembly. Full pinout configurations, physical footprint drawings, and rated operating tolerances are documented in the official XCVU13P-3FHGB2104E datasheet above.

Why is pricing for XCVU13P-3FHGB2104E available via RFQ rather than a fixed checkout price?

Electronic component spot-market pricing for XCVU13P-3FHGB2104E fluctuates based on real-time global availability, production date codes, minimum order quantities (MOQ), and packaging formats (e.g., Reel, Tube, Tray). Using an RFQ ensures you receive accurate, real-time volume pricing tied to verified, traceable inventory rather than stale catalog estimates.

How quickly can XCVU13P-3FHGB2104E be shipped once quoted?

Lead times for XCVU13P-3FHGB2104E depend on whether stock is dispatched from our central hub or regional franchise partners. Ready-to-ship inventory typically leaves the warehouse within 1–3 business days following quality inspection, while factory-direct or back-ordered allocations are confirmed with an estimated ship date upon RFQ reply.

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