
| Type | Description | ||
|---|---|---|---|
| Series | Spartan®-II | Packaging | Tray |
| Part Status | Obsolete | Manufacturer Lead Time | 16 Weeks |
| Mounting Type | Surface Mount | Number of Gates | 30000 |
| Number of I/O | 92 | Number of LABs/CLBs | 216 |
| Number of Logic Elements/Cells | 972 | Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 144-LQFP | Supplier Device Package | 144-TQFP (20x20) |
| Total RAM Bits | 24576 | Voltage - Supply | 2.375V ~ 2.625V |
| ExportControlClassNumber | EAR99 | HtsusCode | 8542.31.0060 |
| MoistureSensitivityLevel | 3 (168 Hours) | ReachStatus | REACH Unaffected |
| RoHS Status | RoHS Compliant |
YG GROUP (YUGUANG INTERNATIONAL(HK)CO.,LTD) supports reliable sourcing through quality controls and compliance documentation. Please confirm product requirements, applicable certifications and supporting documents before ordering.
XC2S30-5TQG144I is an authentic electronic component manufactured by Xilinx, categorized under Interface ICs. It is supplied in the standard manufacturer-specified package footprint, providing industry-standard mechanical dimensions and terminal configurations for board-level assembly. Full pinout configurations, physical footprint drawings, and rated operating tolerances are documented in the official XC2S30-5TQG144I datasheet above.
Electronic component spot-market pricing for XC2S30-5TQG144I fluctuates based on real-time global availability, production date codes, minimum order quantities (MOQ), and packaging formats (e.g., Reel, Tube, Tray). Using an RFQ ensures you receive accurate, real-time volume pricing tied to verified, traceable inventory rather than stale catalog estimates.
Lead times for XC2S30-5TQG144I depend on whether stock is dispatched from our central hub or regional franchise partners. Ready-to-ship inventory typically leaves the warehouse within 1–3 business days following quality inspection, while factory-direct or back-ordered allocations are confirmed with an estimated ship date upon RFQ reply.
Loading articles…
Loading articles…

Explore MLCC miniaturization through Murata GRM158C80G226ME01D, linking its 22 µF, 4 V, 0402-inch specification to effective capacitance, consumer-use limits and real PCB area.
Read more →
Assess what the proposed Winbond–Infineon NOR Flash transaction means for W25Q64JVSSIQ sourcing, with dated deal status, exact-code checks and a practical alternative-qualification framework.
Read more →
Design an ALDP1F06 driver by checking its 6 V coil, diode-qualified release-time limit, flyback clamp stress, hot restart and the actual contact event required by the appliance.
Read more →
Use TAS5431QPWPRQ1 to assess an eCall speaker connection by interpreting load-test timing, I²C fault bits, open-load reporting and recovery during backup-supply transitions.
Read more →Loading related products…
| Picture | Part Number | Manufacturer | PDF / RoHS | Stock | Action |
|---|---|---|---|---|---|
![]() | Xilinx | - | 3,170 | ||
![]() | Xilinx | 5,660 | |||
![]() | Xilinx | 7,370 | |||
![]() | Xilinx | 1,170 | |||
![]() | Xilinx | 6,290 | |||
![]() | Xilinx | 4,970 | |||
![]() | Xilinx | -- | 3,580 | ||
![]() | Xilinx | 7,050 | |||
![]() | Xilinx | 8,190 | |||
![]() | Xilinx | 2,600 |