
| Type | Description | ||
|---|---|---|---|
| Pbfree Code | Yes | RoHS Status | RoHS Compliant |
| Part Life Cycle Code | Obsolete | Package Description | 0.400 X 0.875 INCH, 0.80 MM PITCH, ROHS COMPLIANT, TSOP2-54 |
| Reach Compliance Code | unknown | ECCN Code | EAR99 |
| HTS Code | 8542.32.00.28 | Access Mode | FOUR BANK PAGE BURST |
| Access Time-Max | 5.4 ns | Additional Feature | AUTO/SELF REFRESH |
| Clock Frequency-Max (fCLK) | 133 MHz | I/O Type | COMMON |
| Interleaved Burst Length | 1,2,4,8 | JESD-30 Code | R-PDSO-G54 |
| JESD-609 Code | e6 | Length | 22.22 mm |
| Memory Density | 536870912 bit | Memory IC Type | SYNCHRONOUS DRAM |
| Memory Width | 16 | Moisture Sensitivity Level | 3 |
YG GROUP (YUGUANG INTERNATIONAL(HK)CO.,LTD) supports reliable sourcing through quality controls and compliance documentation. Please confirm product requirements, applicable certifications and supporting documents before ordering.
K4S511632D-UC75 is an authentic electronic component manufactured by Samsung, categorized under DRAM. It is supplied in the standard manufacturer-specified package footprint, providing industry-standard mechanical dimensions and terminal configurations for board-level assembly. Full pinout configurations, physical footprint drawings, and rated operating tolerances are documented in the official K4S511632D-UC75 datasheet above.
Electronic component spot-market pricing for K4S511632D-UC75 fluctuates based on real-time global availability, production date codes, minimum order quantities (MOQ), and packaging formats (e.g., Reel, Tube, Tray). Using an RFQ ensures you receive accurate, real-time volume pricing tied to verified, traceable inventory rather than stale catalog estimates.
Lead times for K4S511632D-UC75 depend on whether stock is dispatched from our central hub or regional franchise partners. Ready-to-ship inventory typically leaves the warehouse within 1–3 business days following quality inspection, while factory-direct or back-ordered allocations are confirmed with an estimated ship date upon RFQ reply.
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