
| Type | Description | ||
|---|---|---|---|
| Density | 32 Gb | Package | 556 FBGA |
| Speed | 4266 Mbps | Voltage | 1.8 / 1.1 / 0.6 V |
| Temperature | -25 ~ 85 °C | Organization | x64 |
| Product Status | EOL |
YG GROUP supports reliable sourcing through quality controls and compliance documentation. Please confirm product requirements, applicable certifications and supporting documents before ordering.
K3UH5H50AM-AGCL is an authentic electronic component manufactured by Samsung, categorized under DRAM. It is supplied in the standard 556 FBGA package footprint, providing industry-standard mechanical dimensions and terminal configurations for board-level assembly. Full pinout configurations, physical footprint drawings, and rated operating tolerances are documented in the official K3UH5H50AM-AGCL datasheet above.
Electronic component spot-market pricing for K3UH5H50AM-AGCL fluctuates based on real-time global availability, production date codes, minimum order quantities (MOQ), and packaging formats (e.g., Reel, Tube, Tray). Using an RFQ ensures you receive accurate, real-time volume pricing tied to verified, traceable inventory rather than stale catalog estimates.
Lead times for K3UH5H50AM-AGCL depend on whether stock is dispatched from our central hub or regional franchise partners. Ready-to-ship inventory typically leaves the warehouse within 1–3 business days following quality inspection, while factory-direct or back-ordered allocations are confirmed with an estimated ship date upon RFQ reply.
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