
| Type | Description | ||
|---|---|---|---|
| Series | M16C™ M16C/60/6N4 | Packaging | Tray |
| Part Status | Obsolete | Manufacturer Lead Time | 12 Weeks |
| Connectivity | CANbus, I2C, IEBus, SIO, UART/USART | Core Processor | M16C/60 |
| Core Size | 16-Bit | Data Converters | A/D 26x10b; D/A 2x8b |
| Mounting Type | Surface Mount | Number of I/O | 85 |
| Operating Temperature | -40°C ~ 85°C (TA) | Oscillator Type | Internal |
| Package / Case | 100-LQFP | Peripherals | DMA, WDT |
| Program Memory Size | 256KB (256K x 8) | Program Memory Type | FLASH |
| RAM Size | 10K x 8 | Speed | 24MHz |
| Supplier Device Package | 100-LFQFP (14x14) | Voltage - Supply (Vcc/Vdd) | 3V ~ 5.5V |
YG GROUP (YUGUANG INTERNATIONAL(HK)CO.,LTD) supports reliable sourcing through quality controls and compliance documentation. Please confirm product requirements, applicable certifications and supporting documents before ordering.
M306N4FGGP#U3 is an authentic electronic component manufactured by Renesas, categorized under Interface ICs. It is supplied in the standard manufacturer-specified package footprint, providing industry-standard mechanical dimensions and terminal configurations for board-level assembly. Full pinout configurations, physical footprint drawings, and rated operating tolerances are documented in the official M306N4FGGP#U3 datasheet above.
Electronic component spot-market pricing for M306N4FGGP#U3 fluctuates based on real-time global availability, production date codes, minimum order quantities (MOQ), and packaging formats (e.g., Reel, Tube, Tray). Using an RFQ ensures you receive accurate, real-time volume pricing tied to verified, traceable inventory rather than stale catalog estimates.
Lead times for M306N4FGGP#U3 depend on whether stock is dispatched from our central hub or regional franchise partners. Ready-to-ship inventory typically leaves the warehouse within 1–3 business days following quality inspection, while factory-direct or back-ordered allocations are confirmed with an estimated ship date upon RFQ reply.
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