
| Type | Description | ||
|---|---|---|---|
| Lead Count (#) | 28 | Carrier Type | Reel |
| Moisture Sensitivity Level (MSL) | 3 | Pb (Lead) Free | Yes |
| Pb Free Category | Pb-Free 100% Matte Tin Plate w/Anneal-e3 | Temp. Range (°C) | -40 to +85°C |
| Country of Assembly | PHILIPPINES, MALAYSIA | Country of Wafer Fabrication | USA |
| Data Rate RS-485/RS-232 | 20, 0.115 | ESD Level (contact discharge) | ±15kV |
| ESD Standard | HBM | High ESD (kV) | 15 |
| Length (mm) | 10.2 | Loopback Feature | No |
| MOQ | 1000 | Operating Supply Current Icc RS-485/RS-232 | 3.7 |
| Pitch (mm) | 0.7 | Pkg. Dimensions (mm) | 10.2 x 5.3 x 1.75 |
| Pkg. Type | SSOP | Port Assignment | fixed |
YG GROUP (YUGUANG INTERNATIONAL(HK)CO.,LTD) supports reliable sourcing through quality controls and compliance documentation. Please confirm product requirements, applicable certifications and supporting documents before ordering.
ISL33354EIAZ-T is an authentic electronic component manufactured by Renesas, categorized under Interface ICs. It is supplied in the standard manufacturer-specified package footprint, providing industry-standard mechanical dimensions and terminal configurations for board-level assembly. Full pinout configurations, physical footprint drawings, and rated operating tolerances are documented in the official ISL33354EIAZ-T datasheet above.
Electronic component spot-market pricing for ISL33354EIAZ-T fluctuates based on real-time global availability, production date codes, minimum order quantities (MOQ), and packaging formats (e.g., Reel, Tube, Tray). Using an RFQ ensures you receive accurate, real-time volume pricing tied to verified, traceable inventory rather than stale catalog estimates.
Lead times for ISL33354EIAZ-T depend on whether stock is dispatched from our central hub or regional franchise partners. Ready-to-ship inventory typically leaves the warehouse within 1–3 business days following quality inspection, while factory-direct or back-ordered allocations are confirmed with an estimated ship date upon RFQ reply.
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