
| Type | Description | ||
|---|---|---|---|
| Packaging | Tray | Part Status | Active |
| Manufacturer Lead Time | 99 Weeks | Access Time | 8 ns |
| Clock Frequency | 104 MHz | Memory Format | FLASH |
| Memory Interface | SPI - Dual I/O | Memory Organization | 64K x 8 |
| Memory Size | 512Kbit | Memory Type | Non-Volatile |
| Mounting Type | Surface Mount | Operating Temperature | -40°C ~ 85°C (TC) |
| Package / Case | Die | Supplier Device Package | Wafer |
| Technology | FLASH - NOR (SLC) | Voltage - Supply | 1.65V ~ 3.6V |
| Write Cycle Time - Word, Page | 8µs, 3.5ms | MoistureSensitivityLevel | 1 (Unlimited) |
| ReachStatus | REACH Unknown | RoHS Status | RoHS Compliant |
YG GROUP (YUGUANG INTERNATIONAL(HK)CO.,LTD) supports reliable sourcing through quality controls and compliance documentation. Please confirm product requirements, applicable certifications and supporting documents before ordering.
AT25DF512C-DWF is an authentic electronic component manufactured by Renesas, categorized under Interface ICs. It is supplied in the standard manufacturer-specified package footprint, providing industry-standard mechanical dimensions and terminal configurations for board-level assembly. Full pinout configurations, physical footprint drawings, and rated operating tolerances are documented in the official AT25DF512C-DWF datasheet above.
Electronic component spot-market pricing for AT25DF512C-DWF fluctuates based on real-time global availability, production date codes, minimum order quantities (MOQ), and packaging formats (e.g., Reel, Tube, Tray). Using an RFQ ensures you receive accurate, real-time volume pricing tied to verified, traceable inventory rather than stale catalog estimates.
Lead times for AT25DF512C-DWF depend on whether stock is dispatched from our central hub or regional franchise partners. Ready-to-ship inventory typically leaves the warehouse within 1–3 business days following quality inspection, while factory-direct or back-ordered allocations are confirmed with an estimated ship date upon RFQ reply.
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