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  1. Home
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  4. /DRAM
  5. /MT62F2G32D4DS-023 IT:B
MT62F2G32D4DS-023 IT:B thumbnail 1
Micron

MT62F2G32D4DS-023 IT:B

Category
DRAM
Manufacturer
MicronDetails
Datasheet
—
Description
200-WFBGA (10x14.5) Memory (ICs) ROHS
Similar Products
—
Quality Control
Authentic & Traceable
Shipping (In-stock)
1-3 business days
Quote Response
Within 24 Hours
Stock Status6520
QuantityMT62F2G32D4DS-023 IT:B
Country

Get Tiered Pricing (Submit RFQ)

Specification
TypeDescriptionTypeDescription
Component Density64GbSpeed4266MHz
MT/s8533MTPSI/O Voltage0.5 VOLTS
Operating Temp-40C to +95CBus Widthx32
CAS LatencyCL = ProgrammablePin Count315-ball
Part Status CodeEnd of LifeComponent Config2Gb x32
Dry Pack Qty1050Package Dimension (W x L x H) mm12.40 x 15.00 x 1.10
Tape & Reel Qty2000Package TypeGREEN
Number of Components4TechnologyLPDDR5
PackageTFBGAFamilyDRAM
Certified Quality & Compliance
Purchase & Inquiry
Secure Packaging
Shipping & Availability
Payment

YG GROUP (YUGUANG INTERNATIONAL(HK)CO.,LTD) supports reliable sourcing through quality controls and compliance documentation. Please confirm product requirements, applicable certifications and supporting documents before ordering.

  • 1. Certification Scope: Quality certifications apply only to the entities, sites and activities listed in valid certificates. Management system certification does not certify each individual product.
  • 2. Product Authenticity: Products must match the agreed manufacturer, part number and condition. Supplier screening and authenticity checks help reduce counterfeit risk.
  • 3. Inspection & Testing: The inspection scope follows product risks and agreed requirements. Additional testing, laboratory arrangements, costs and lead times require written confirmation.
  • 4. Traceability & Documentation: Request conformity certificates, traceability records or test reports before ordering. Document availability, issuer and coverage must be confirmed for the offered goods.
  • 5. Environmental Compliance: RoHS and REACH information is based on applicable manufacturer documentation. Confirm the exact part, declaration date and relevant exemptions before ordering.
  • 6. Handling & Protection: Handling, storage and packaging follow applicable product requirements, including ESD and moisture protection where required. Special handling requirements must be agreed before ordering.
ERAI
ISO 9001
ESD Control

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Product FAQ
Purchasing FAQ

What type of component is MT62F2G32D4DS-023 IT:B, and what package does it use?

MT62F2G32D4DS-023 IT:B is an authentic electronic component manufactured by Micron, categorized under DRAM. It is supplied in the standard TFBGA package footprint, providing industry-standard mechanical dimensions and terminal configurations for board-level assembly. Full pinout configurations, physical footprint drawings, and rated operating tolerances are documented in the official MT62F2G32D4DS-023 IT:B datasheet above.

Why is pricing for MT62F2G32D4DS-023 IT:B available via RFQ rather than a fixed checkout price?

Electronic component spot-market pricing for MT62F2G32D4DS-023 IT:B fluctuates based on real-time global availability, production date codes, minimum order quantities (MOQ), and packaging formats (e.g., Reel, Tube, Tray). Using an RFQ ensures you receive accurate, real-time volume pricing tied to verified, traceable inventory rather than stale catalog estimates.

How quickly can MT62F2G32D4DS-023 IT:B be shipped once quoted?

Lead times for MT62F2G32D4DS-023 IT:B depend on whether stock is dispatched from our central hub or regional franchise partners. Ready-to-ship inventory typically leaves the warehouse within 1–3 business days following quality inspection, while factory-direct or back-ordered allocations are confirmed with an estimated ship date upon RFQ reply.

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