
| Type | Description | ||
|---|---|---|---|
| Lead Count (#) | 8 | Carrier Type | Tube |
| Moisture Sensitivity Level (MSL) | 1 | Pitch (mm) | 1.27 |
| Pkg. Dimensions (mm) | 4.9 x 3.9 x 1.5 | Qty. per Reel (#) | 0 |
| Qty. per Carrier (#) | 97 | Pb (Lead) Free | Yes |
| Pb Free Category | e3 Sn | Temp. Range (°C) | -40 to 85°C |
| Country of Wafer Fabrication | GERMANY | Country of Assembly | PHILIPPINES |
| Adj. Analog Gain | 1.5 - 1.5, 3 - 3, 6 - 6, 12 - 12, 24 - 24, 48 - 48, 96 - 96, 192 - 192 | Automotive Qual. | No |
| Function | Resistive SSC | Input Type | Single-bridge |
| Interface | I2C, SPI | Length (mm) | 4.9 |
| MOQ | 97 | Package Area (mm²) | 19.1 |
YG GROUP (YUGUANG INTERNATIONAL(HK)CO.,LTD) supports reliable sourcing through quality controls and compliance documentation. Please confirm product requirements, applicable certifications and supporting documents before ordering.
ZSC31014EIG1-T is an authentic electronic component manufactured by Renesas, categorized under Integrated Circuits - ICs. It is supplied in the standard manufacturer-specified package footprint, providing industry-standard mechanical dimensions and terminal configurations for board-level assembly. Full pinout configurations, physical footprint drawings, and rated operating tolerances are documented in the official ZSC31014EIG1-T datasheet above.
Electronic component spot-market pricing for ZSC31014EIG1-T fluctuates based on real-time global availability, production date codes, minimum order quantities (MOQ), and packaging formats (e.g., Reel, Tube, Tray). Using an RFQ ensures you receive accurate, real-time volume pricing tied to verified, traceable inventory rather than stale catalog estimates.
Lead times for ZSC31014EIG1-T depend on whether stock is dispatched from our central hub or regional franchise partners. Ready-to-ship inventory typically leaves the warehouse within 1–3 business days following quality inspection, while factory-direct or back-ordered allocations are confirmed with an estimated ship date upon RFQ reply.
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