
UCC27524ADR: Dual 5A Outputs and Parallel-Drive Checks
UCC27524ADR is a TI dual 5 A low-side driver in SOIC-8. Share PWM and enable, then check TI’s edge-rate guidance and board-level skew. Request a quote.
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| Type | Description | ||
|---|---|---|---|
| Package | SSOP-28-150mil | Number of Lines | 1 |
| Operating temperature | -40℃~+85℃ | Mounting Type | Surface Mount |
| CNHTS | 8536300000 | USHTS | 8536308000 |
| TARIC | 8536301010 | CAHTS | 8536302000 |
| BRHTS | 85363090 | INHTS | 85363000 |
| MXHTS | 8536.30.01 |
YG GROUP (YUGUANG INTERNATIONAL(HK)CO.,LTD) supports reliable sourcing through quality controls and compliance documentation. Please confirm product requirements, applicable certifications and supporting documents before ordering.
LTC4261IGN#PBF is an authentic electronic component manufactured by Analog Devices, categorized under Surge Protective Devices - SPD. It is supplied in the standard SSOP-28-150mil package footprint, providing industry-standard mechanical dimensions and terminal configurations for board-level assembly. Full pinout configurations, physical footprint drawings, and rated operating tolerances are documented in the official LTC4261IGN#PBF datasheet above.
Electronic component spot-market pricing for LTC4261IGN#PBF fluctuates based on real-time global availability, production date codes, minimum order quantities (MOQ), and packaging formats (e.g., Reel, Tube, Tray). Using an RFQ ensures you receive accurate, real-time volume pricing tied to verified, traceable inventory rather than stale catalog estimates.
Lead times for LTC4261IGN#PBF depend on whether stock is dispatched from our central hub or regional franchise partners. Ready-to-ship inventory typically leaves the warehouse within 1–3 business days following quality inspection, while factory-direct or back-ordered allocations are confirmed with an estimated ship date upon RFQ reply.
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UCC27524ADR is a TI dual 5 A low-side driver in SOIC-8. Share PWM and enable, then check TI’s edge-rate guidance and board-level skew. Request a quote.
Read more →
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