
| Type | Description | ||
|---|---|---|---|
| Packaging | Bulk | Part Status | Active |
| Manufacturer Lead Time | 1 Weeks | Mounting Type | Surface Mount |
| Number of Gates | 2541952 | Number of I/O | 660 |
| Number of LABs/CLBs | 9600 | Number of Logic Elements/Cells | 43200 |
| Operating Temperature | -40°C ~ 100°C (TJ) | Package / Case | 860-BGA Exposed Pad |
| Supplier Device Package | 860-FBGA (42.5x42.5) | Total RAM Bits | 655360 |
| Voltage - Supply | 1.71V ~ 1.89V | HtsusCode | 8542.31.0060 |
| MoistureSensitivityLevel | Vendor Undefined | ReachStatus | REACH Affected |
| RoHS Status | Non-RoHS Compliant |
YG GROUP (YUGUANG INTERNATIONAL(HK)CO.,LTD) supports reliable sourcing through quality controls and compliance documentation. Please confirm product requirements, applicable certifications and supporting documents before ordering.
XCV2000E-6FG860I is an authentic electronic component manufactured by Xilinx, categorized under Interface ICs. It is supplied in the standard manufacturer-specified package footprint, providing industry-standard mechanical dimensions and terminal configurations for board-level assembly. Full pinout configurations, physical footprint drawings, and rated operating tolerances are documented in the official XCV2000E-6FG860I datasheet above.
Electronic component spot-market pricing for XCV2000E-6FG860I fluctuates based on real-time global availability, production date codes, minimum order quantities (MOQ), and packaging formats (e.g., Reel, Tube, Tray). Using an RFQ ensures you receive accurate, real-time volume pricing tied to verified, traceable inventory rather than stale catalog estimates.
Lead times for XCV2000E-6FG860I depend on whether stock is dispatched from our central hub or regional franchise partners. Ready-to-ship inventory typically leaves the warehouse within 1–3 business days following quality inspection, while factory-direct or back-ordered allocations are confirmed with an estimated ship date upon RFQ reply.
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