| Type | Description | ||
|---|---|---|---|
| Pbfree Code | No | RoHS Status | Non-RoHS Compliant |
| Part Life Cycle Code | Obsolete | Part Package Code | BGA |
| Package Description | FBGA-256 | Pin Count | 256 |
| Reach Compliance Code | not_compliant | ECCN Code | EAR99 |
| HTS Code | 8542.39.00.01 | Clock Frequency-Max | 357 MHz |
| Combinatorial Delay of a CLB-Max | 0.47 ns | JESD-30 Code | S-PBGA-B256 |
| JESD-609 Code | e0 | Length | 17 mm |
| Moisture Sensitivity Level | 3 | Number of CLBs | 600 |
| Number of Equivalent Gates | 32400 | Number of Inputs | 176 |
| Number of Logic Cells | 2700 | Number of Outputs | 176 |
YG GROUP (YUGUANG INTERNATIONAL(HK)CO.,LTD) supports reliable sourcing through quality controls and compliance documentation. Please confirm product requirements, applicable certifications and supporting documents before ordering.
XCV100E-6FG256C is an authentic electronic component manufactured by Xilinx, categorized under Programmable Logic ICs. It is supplied in the standard manufacturer-specified package footprint, providing industry-standard mechanical dimensions and terminal configurations for board-level assembly. Full pinout configurations, physical footprint drawings, and rated operating tolerances are documented in the official XCV100E-6FG256C datasheet above.
Electronic component spot-market pricing for XCV100E-6FG256C fluctuates based on real-time global availability, production date codes, minimum order quantities (MOQ), and packaging formats (e.g., Reel, Tube, Tray). Using an RFQ ensures you receive accurate, real-time volume pricing tied to verified, traceable inventory rather than stale catalog estimates.
Lead times for XCV100E-6FG256C depend on whether stock is dispatched from our central hub or regional franchise partners. Ready-to-ship inventory typically leaves the warehouse within 1–3 business days following quality inspection, while factory-direct or back-ordered allocations are confirmed with an estimated ship date upon RFQ reply.
Loading articles…
Loading articles…
Explore MLCC miniaturization through Murata GRM158C80G226ME01D, linking its 22 µF, 4 V, 0402-inch specification to effective capacitance, consumer-use limits and real PCB area.
Read more →
Assess what the proposed Winbond–Infineon NOR Flash transaction means for W25Q64JVSSIQ sourcing, with dated deal status, exact-code checks and a practical alternative-qualification framework.
Read more →
Design an ALDP1F06 driver by checking its 6 V coil, diode-qualified release-time limit, flyback clamp stress, hot restart and the actual contact event required by the appliance.
Read more →
Use TAS5431QPWPRQ1 to assess an eCall speaker connection by interpreting load-test timing, I²C fault bits, open-load reporting and recovery during backup-supply transitions.
Read more →Loading related products…
| Picture | Part Number | Manufacturer | PDF / RoHS | Stock | Action |
|---|---|---|---|---|---|
| Xilinx | 4,280 | |||
| Xilinx | -- | 6,080 | ||
| Xilinx | -- | 3,230 | ||
| Xilinx | 1,120 | |||
| Xilinx | 4,260 | |||
| Xilinx | -- | 6,220 | ||
| Xilinx | 4,880 | |||
| Xilinx | -- | 6,170 | ||
| Xilinx | 5,890 | |||
| Xilinx | 7,080 |
