
| Type | Description | ||
|---|---|---|---|
| Rohs Code | Yes | Part Life Cycle Code | Active |
| Package Description | 15 X 15 MM, 0.80 MM PITCH, LEAD FREE, BGA-324 | Reach Compliance Code | compliant |
| Factory Lead Time | 12 Weeks | Clock Frequency-Max | 862 MHz |
| Combinatorial Delay of a CLB-Max | 0.21 ns | JESD-30 Code | S-PBGA-B324 |
| JESD-609 Code | e1 | Length | 15 mm |
| Moisture Sensitivity Level | 3 | Number of CLBs | 715 |
| Number of Inputs | 200 | Number of Logic Cells | 9152 |
| Number of Outputs | 200 | Number of Terminals | 324 |
| Operating Temperature-Max | 85 °C | Organization | 715 CLBS |
| Package Body Material | PLASTIC/EPOXY | Package Code | LFBGA |
YG GROUP (YUGUANG INTERNATIONAL(HK)CO.,LTD) supports reliable sourcing through quality controls and compliance documentation. Please confirm product requirements, applicable certifications and supporting documents before ordering.
XC6SLX9-3CSG324C is an authentic electronic component manufactured by Xilinx, categorized under Programmable Logic ICs. It is supplied in the standard manufacturer-specified package footprint, providing industry-standard mechanical dimensions and terminal configurations for board-level assembly. Full pinout configurations, physical footprint drawings, and rated operating tolerances are documented in the official XC6SLX9-3CSG324C datasheet above.
Electronic component spot-market pricing for XC6SLX9-3CSG324C fluctuates based on real-time global availability, production date codes, minimum order quantities (MOQ), and packaging formats (e.g., Reel, Tube, Tray). Using an RFQ ensures you receive accurate, real-time volume pricing tied to verified, traceable inventory rather than stale catalog estimates.
Lead times for XC6SLX9-3CSG324C depend on whether stock is dispatched from our central hub or regional franchise partners. Ready-to-ship inventory typically leaves the warehouse within 1–3 business days following quality inspection, while factory-direct or back-ordered allocations are confirmed with an estimated ship date upon RFQ reply.
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