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  1. Home
  2. /Products
  3. /Integrated Circuits - ICs
  4. /Interface ICs
  5. /XC3SD3400A-4FGG676C
XC3SD3400A-4FGG676C thumbnail 1
Xilinx

XC3SD3400A-4FGG676C

Category
Interface ICs
Manufacturer
XilinxDetails
RoHS Status
Datasheet
Description
IC FPGA 469 I/O 676FBGA.Spartan®-3A DSP Field Programmable Gate Array (FPGA) IC 469 2322432 53712 676-BGA
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Quality Control
Authentic & Traceable
Shipping (In-stock)
1-3 business days
Quote Response
Within 24 Hours
Stock Status8480
QuantityXC3SD3400A-4FGG676C
Country

Get Tiered Pricing (Submit RFQ)

Specification
Documentation
TypeDescriptionTypeDescription
SeriesSpartan®-3A DSPPackagingTray
Part StatusObsoleteManufacturer Lead Time16 Weeks
Mounting TypeSurface MountNumber of Gates3400000
Number of I/O469Number of LABs/CLBs5968
Number of Logic Elements/Cells53712Operating Temperature0°C ~ 85°C (TJ)
Package / Case676-BGASupplier Device Package676-FBGA (27x27)
Total RAM Bits2322432Voltage - Supply1.14V ~ 1.26V
ExportControlClassNumber3A991DHtsusCode8542.31.0060
MoistureSensitivityLevel3 (168 Hours)ReachStatusREACH Unaffected
RoHS StatusRoHS Compliant
Certified Quality & Compliance
Purchase & Inquiry
Secure Packaging
Shipping & Availability
Payment

YG GROUP (YUGUANG INTERNATIONAL(HK)CO.,LTD) supports reliable sourcing through quality controls and compliance documentation. Please confirm product requirements, applicable certifications and supporting documents before ordering.

  • 1. Certification Scope: Quality certifications apply only to the entities, sites and activities listed in valid certificates. Management system certification does not certify each individual product.
  • 2. Product Authenticity: Products must match the agreed manufacturer, part number and condition. Supplier screening and authenticity checks help reduce counterfeit risk.
  • 3. Inspection & Testing: The inspection scope follows product risks and agreed requirements. Additional testing, laboratory arrangements, costs and lead times require written confirmation.
  • 4. Traceability & Documentation: Request conformity certificates, traceability records or test reports before ordering. Document availability, issuer and coverage must be confirmed for the offered goods.
  • 5. Environmental Compliance: RoHS and REACH information is based on applicable manufacturer documentation. Confirm the exact part, declaration date and relevant exemptions before ordering.
  • 6. Handling & Protection: Handling, storage and packaging follow applicable product requirements, including ESD and moisture protection where required. Special handling requirements must be agreed before ordering.
ERAI
ISO 9001
ESD Control

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Product FAQ
Purchasing FAQ

What type of component is XC3SD3400A-4FGG676C, and what package does it use?

XC3SD3400A-4FGG676C is an authentic electronic component manufactured by Xilinx, categorized under Interface ICs. It is supplied in the standard manufacturer-specified package footprint, providing industry-standard mechanical dimensions and terminal configurations for board-level assembly. Full pinout configurations, physical footprint drawings, and rated operating tolerances are documented in the official XC3SD3400A-4FGG676C datasheet above.

Why is dynamic quotation used instead of a fixed price for XC3SD3400A-4FGG676C?

Electronic component spot-market pricing for XC3SD3400A-4FGG676C fluctuates based on real-time global availability, production date codes, minimum order quantities (MOQ), and packaging formats (e.g., Reel, Tube, Tray). Using an RFQ ensures you receive accurate, real-time volume pricing tied to verified, traceable inventory rather than stale catalog estimates.

What is the delivery timeline after placing an order for XC3SD3400A-4FGG676C?

Lead times for XC3SD3400A-4FGG676C depend on whether stock is dispatched from our central hub or regional franchise partners. Ready-to-ship inventory typically leaves the warehouse within 1–3 business days following quality inspection, while factory-direct or back-ordered allocations are confirmed with an estimated ship date upon RFQ reply.

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