
| Type | Description | ||
|---|---|---|---|
| Package | FBGA-456(23x23) | Embedded Block RAM | 589824bit |
| Number of Logic Elements/Blocks | 29952 | Logic Array Blocks | 3328 |
| Operating Temperature | 0℃~+85℃ | CNHTS | 8542319090 |
YG GROUP (YUGUANG INTERNATIONAL(HK)CO.,LTD) supports reliable sourcing through quality controls and compliance documentation. Please confirm product requirements, applicable certifications and supporting documents before ordering.
XC3S1500-5FGG456C is an authentic electronic component manufactured by Xilinx, categorized under Programmable Logic ICs. It is supplied in the standard FBGA-456(23x23) package footprint, providing industry-standard mechanical dimensions and terminal configurations for board-level assembly. Full pinout configurations, physical footprint drawings, and rated operating tolerances are documented in the official XC3S1500-5FGG456C datasheet above.
Electronic component spot-market pricing for XC3S1500-5FGG456C fluctuates based on real-time global availability, production date codes, minimum order quantities (MOQ), and packaging formats (e.g., Reel, Tube, Tray). Using an RFQ ensures you receive accurate, real-time volume pricing tied to verified, traceable inventory rather than stale catalog estimates.
Lead times for XC3S1500-5FGG456C depend on whether stock is dispatched from our central hub or regional franchise partners. Ready-to-ship inventory typically leaves the warehouse within 1–3 business days following quality inspection, while factory-direct or back-ordered allocations are confirmed with an estimated ship date upon RFQ reply.
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