
W25N01GVZEIG: 1Gb NAND ECC and Bad-Block Management
W25N01GVZEIG is a Winbond 1Gb 3V SPI NAND flash with 1-bit ECC in 8x6mm WSON. Preserve bad-block markers and G-suffix BUF mode. Request a quote today.
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| Type | Description | ||
|---|---|---|---|
| Series | Spartan®-3A | Packaging | Tray |
| Part Status | Obsolete | Manufacturer Lead Time | 16 Weeks |
| Mounting Type | Surface Mount | Number of Gates | 1400000 |
| Number of I/O | 161 | Number of LABs/CLBs | 2816 |
| Number of Logic Elements/Cells | 25344 | Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 256-LBGA | Supplier Device Package | 256-FTBGA (17x17) |
| Total RAM Bits | 589824 | Voltage - Supply | 1.14V ~ 1.26V |
| ExportControlClassNumber | EAR99 | HtsusCode | 8542.31.0060 |
| MoistureSensitivityLevel | 3 (168 Hours) | ReachStatus | REACH Unaffected |
| RohsStatus | ROHS3 Compliant |
YG GROUP (YUGUANG INTERNATIONAL(HK)CO.,LTD) supports reliable sourcing through quality controls and compliance documentation. Please confirm product requirements, applicable certifications and supporting documents before ordering.
XC3S1400A-4FTG256C is an authentic electronic component manufactured by Xilinx, categorized under Interface ICs. It is supplied in the standard manufacturer-specified package footprint, providing industry-standard mechanical dimensions and terminal configurations for board-level assembly. Full pinout configurations, physical footprint drawings, and rated operating tolerances are documented in the official XC3S1400A-4FTG256C datasheet above.
Electronic component spot-market pricing for XC3S1400A-4FTG256C fluctuates based on real-time global availability, production date codes, minimum order quantities (MOQ), and packaging formats (e.g., Reel, Tube, Tray). Using an RFQ ensures you receive accurate, real-time volume pricing tied to verified, traceable inventory rather than stale catalog estimates.
Lead times for XC3S1400A-4FTG256C depend on whether stock is dispatched from our central hub or regional franchise partners. Ready-to-ship inventory typically leaves the warehouse within 1–3 business days following quality inspection, while factory-direct or back-ordered allocations are confirmed with an estimated ship date upon RFQ reply.
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W25N01GVZEIG is a Winbond 1Gb 3V SPI NAND flash with 1-bit ECC in 8x6mm WSON. Preserve bad-block markers and G-suffix BUF mode. Request a quote today.
Read more →
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| Picture | Part Number | Manufacturer | PDF / RoHS | Stock | Action |
|---|---|---|---|---|---|
| Xilinx | 4,600 | ||||
| Xilinx | 2,900 | ||||
| Xilinx | 2,500 | ||||
| Xilinx | 5,540 | ||||
| Xilinx | 8,870 | ||||
| Xilinx | 8,910 | ||||
| Xilinx | 1,930 | ||||
| Xilinx | 2,770 | ||||
| Xilinx | 7,470 | ||||
| Xilinx | 7,540 |