
| Type | Description | ||
|---|---|---|---|
| Pbfree Code | Yes | RoHS Status | RoHS Compliant |
| Part Life Cycle Code | Obsolete | Part Package Code | BGA |
| Package Description | LEAD FREE, FBGA-256 | Pin Count | 256 |
| Reach Compliance Code | unknown | ECCN Code | EAR99 |
| HTS Code | 8542.39.00.01 | Additional Feature | MAXIMUM USABLE GATES = 200000 |
| Clock Frequency-Max | 357 MHz | Combinatorial Delay of a CLB-Max | 0.47 ns |
| JESD-30 Code | S-PBGA-B256 | JESD-609 Code | e1 |
| Length | 17 mm | Moisture Sensitivity Level | 3 |
| Number of CLBs | 1176 | Number of Equivalent Gates | 71000 |
| Number of Inputs | 289 | Number of Logic Cells | 5292 |
YG GROUP (YUGUANG INTERNATIONAL(HK)CO.,LTD) supports reliable sourcing through quality controls and compliance documentation. Please confirm product requirements, applicable certifications and supporting documents before ordering.
XC2S200E-6FTG256C is an authentic electronic component manufactured by Xilinx, categorized under Programmable Logic ICs. It is supplied in the standard manufacturer-specified package footprint, providing industry-standard mechanical dimensions and terminal configurations for board-level assembly. Full pinout configurations, physical footprint drawings, and rated operating tolerances are documented in the official XC2S200E-6FTG256C datasheet above.
Electronic component spot-market pricing for XC2S200E-6FTG256C fluctuates based on real-time global availability, production date codes, minimum order quantities (MOQ), and packaging formats (e.g., Reel, Tube, Tray). Using an RFQ ensures you receive accurate, real-time volume pricing tied to verified, traceable inventory rather than stale catalog estimates.
Lead times for XC2S200E-6FTG256C depend on whether stock is dispatched from our central hub or regional franchise partners. Ready-to-ship inventory typically leaves the warehouse within 1–3 business days following quality inspection, while factory-direct or back-ordered allocations are confirmed with an estimated ship date upon RFQ reply.
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