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  5. /W66BQ6NBUAFJ
W66BQ6NBUAFJ thumbnail 1
Winbond

W66BQ6NBUAFJ

Category
Memory IC Development Tools
Manufacturer
WinbondDetails
Datasheet
Description
WFBGA-200(10x14.5) Memory (ICs) RoHS
Similar Products
—
Quality Control
Authentic & Traceable
Shipping (In-stock)
1-3 business days
Quote Response
Within 24 Hours
Stock Status9590
QuantityW66BQ6NBUAFJ
Country

Get Tiered Pricing (Submit RFQ)

Specification
Documentation
TypeDescriptionTypeDescription
PackageWFBGA-200(10x14.5)CNHTS8542329000
USHTS8542320071TARIC8542329000
CAHTS8542330000BRHTS85423299
INHTS85423200MXHTS8542.32.99
Certified Quality & Compliance
Purchase & Inquiry
Secure Packaging
Shipping & Availability
Payment

YG GROUP (YUGUANG INTERNATIONAL(HK)CO.,LTD) supports reliable sourcing through quality controls and compliance documentation. Please confirm product requirements, applicable certifications and supporting documents before ordering.

  • 1. Certification Scope: Quality certifications apply only to the entities, sites and activities listed in valid certificates. Management system certification does not certify each individual product.
  • 2. Product Authenticity: Products must match the agreed manufacturer, part number and condition. Supplier screening and authenticity checks help reduce counterfeit risk.
  • 3. Inspection & Testing: The inspection scope follows product risks and agreed requirements. Additional testing, laboratory arrangements, costs and lead times require written confirmation.
  • 4. Traceability & Documentation: Request conformity certificates, traceability records or test reports before ordering. Document availability, issuer and coverage must be confirmed for the offered goods.
  • 5. Environmental Compliance: RoHS and REACH information is based on applicable manufacturer documentation. Confirm the exact part, declaration date and relevant exemptions before ordering.
  • 6. Handling & Protection: Handling, storage and packaging follow applicable product requirements, including ESD and moisture protection where required. Special handling requirements must be agreed before ordering.
ERAI
ISO 9001
ESD Control

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Product FAQ
Purchasing FAQ

What type of component is W66BQ6NBUAFJ, and what package does it use?

W66BQ6NBUAFJ is an authentic electronic component manufactured by Winbond, categorized under Memory IC Development Tools. It is supplied in the standard WFBGA-200(10x14.5) package footprint, providing industry-standard mechanical dimensions and terminal configurations for board-level assembly. Full pinout configurations, physical footprint drawings, and rated operating tolerances are documented in the official W66BQ6NBUAFJ datasheet above.

Why is dynamic quotation used instead of a fixed price for W66BQ6NBUAFJ?

Electronic component spot-market pricing for W66BQ6NBUAFJ fluctuates based on real-time global availability, production date codes, minimum order quantities (MOQ), and packaging formats (e.g., Reel, Tube, Tray). Using an RFQ ensures you receive accurate, real-time volume pricing tied to verified, traceable inventory rather than stale catalog estimates.

What is the delivery timeline after placing an order for W66BQ6NBUAFJ?

Lead times for W66BQ6NBUAFJ depend on whether stock is dispatched from our central hub or regional franchise partners. Ready-to-ship inventory typically leaves the warehouse within 1–3 business days following quality inspection, while factory-direct or back-ordered allocations are confirmed with an estimated ship date upon RFQ reply.

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