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  1. Home
  2. /Products
  3. /Memory ICs
  4. /NAND Flash
  5. /W25N01JWTBIG
W25N01JWTBIG thumbnail 1
Winbond

W25N01JWTBIG

Category
NAND Flash
Manufacturer
WinbondDetails
Datasheet
Description
W25N01JWTBIG is a Winbond W25N-JW QSPI NAND product: Density 1Gb, STR (MHz) 166, DTR (MHz) 80, Voltage (V) 1.7~1.95, Temp (°C) -40~85, PKG TFBGA (5X5)-24, DIM 6X8MM^2.
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Quality Control
Authentic & Traceable
Shipping (In-stock)
1-3 business days
Quote Response
Within 24 Hours
Stock Status6650
QuantityW25N01JWTBIG
Country

Get Tiered Pricing (Submit RFQ)

Specification
Product Details
Key Features
Applications
Documentation
TypeDescriptionTypeDescription
Density1GbSTR (MHz)166
DTR (MHz)80Voltage (V)1.7~1.95
Temp (°C)-40~85PKGTFBGA (5X5)-24
DIM6X8MM^2Interface TypeSPI/Dual/Quad
Carbon DataYIndustrial StatusP
LongevityNBuilt-in ECC (bit)1
Default Read ModeBuffer ReadRead Mode OptionContinuous Read
Page Size (Byte)2048Spare Area (Byte)64
Product SeriesW25N-JW
Certified Quality & Compliance
Purchase & Inquiry
Secure Packaging
Shipping & Availability
Payment

YG GROUP (YUGUANG INTERNATIONAL(HK)CO.,LTD) supports reliable sourcing through quality controls and compliance documentation. Please confirm product requirements, applicable certifications and supporting documents before ordering.

  • 1. Certification Scope: Quality certifications apply only to the entities, sites and activities listed in valid certificates. Management system certification does not certify each individual product.
  • 2. Product Authenticity: Products must match the agreed manufacturer, part number and condition. Supplier screening and authenticity checks help reduce counterfeit risk.
  • 3. Inspection & Testing: The inspection scope follows product risks and agreed requirements. Additional testing, laboratory arrangements, costs and lead times require written confirmation.
  • 4. Traceability & Documentation: Request conformity certificates, traceability records or test reports before ordering. Document availability, issuer and coverage must be confirmed for the offered goods.
  • 5. Environmental Compliance: RoHS and REACH information is based on applicable manufacturer documentation. Confirm the exact part, declaration date and relevant exemptions before ordering.
  • 6. Handling & Protection: Handling, storage and packaging follow applicable product requirements, including ESD and moisture protection where required. Special handling requirements must be agreed before ordering.
ERAI

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Product FAQ
Purchasing FAQ

What type of component is W25N01JWTBIG, and what package does it use?

W25N01JWTBIG is an authentic electronic component manufactured by Winbond, categorized under NAND Flash. It is supplied in the standard manufacturer-specified package footprint, providing industry-standard mechanical dimensions and terminal configurations for board-level assembly. Full pinout configurations, physical footprint drawings, and rated operating tolerances are documented in the official W25N01JWTBIG datasheet above.

Why is dynamic quotation used instead of a fixed price for W25N01JWTBIG?

Electronic component spot-market pricing for W25N01JWTBIG fluctuates based on real-time global availability, production date codes, minimum order quantities (MOQ), and packaging formats (e.g., Reel, Tube, Tray). Using an RFQ ensures you receive accurate, real-time volume pricing tied to verified, traceable inventory rather than stale catalog estimates.

What is the delivery timeline after placing an order for W25N01JWTBIG?

Lead times for W25N01JWTBIG depend on whether stock is dispatched from our central hub or regional franchise partners. Ready-to-ship inventory typically leaves the warehouse within 1–3 business days following quality inspection, while factory-direct or back-ordered allocations are confirmed with an estimated ship date upon RFQ reply.

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