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  1. Home
  2. /Products
  3. /Memory ICs
  4. /Memory IC Development Tools
  5. /W25B40VSNIG
W25B40VSNIG thumbnail 1
Winbond

W25B40VSNIG

Category
Memory IC Development Tools
Manufacturer
WinbondDetails
RoHS Status
Datasheet
Description
3/3.3V V SpiFlash® Memory IC SpiFlash® Series
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Quality Control
Authentic & Traceable
Shipping (In-stock)
1-3 business days
Quote Response
Within 24 Hours
Stock Status8610
QuantityW25B40VSNIG
Country

Get Tiered Pricing (Submit RFQ)

Specification
Product Details
Key Features
Applications
Documentation
TypeDescriptionTypeDescription
Mounting TypeSurface MountPackage / Case8-SOIC (0.154, 3.90mm Width)
Surface MountYESOperating Temperature-40°C~85°C TA
PackagingTubeSeriesSpiFlash®
Published2006JESD-609 Codee3
Pbfree CodeyesPart StatusObsolete
Moisture Sensitivity Level (MSL)3 (168 Hours)Number of Terminations8
Terminal FinishMATTE TINTechnologyCMOS
Voltage - Supply2.7V~3.6VTerminal PositionDUAL
Peak Reflow Temperature (Cel)225Terminal Pitch1.27mm
Time@Peak Reflow Temperature-Max (s)NOT SPECIFIEDJESD-30 CodeR-PDSO-G8
Certified Quality & Compliance
Purchase & Inquiry
Secure Packaging
Shipping & Availability
Payment

YG GROUP (YUGUANG INTERNATIONAL(HK)CO.,LTD) supports reliable sourcing through quality controls and compliance documentation. Please confirm product requirements, applicable certifications and supporting documents before ordering.

  • 1. Certification Scope: Quality certifications apply only to the entities, sites and activities listed in valid certificates. Management system certification does not certify each individual product.
  • 2. Product Authenticity: Products must match the agreed manufacturer, part number and condition. Supplier screening and authenticity checks help reduce counterfeit risk.
  • 3. Inspection & Testing: The inspection scope follows product risks and agreed requirements. Additional testing, laboratory arrangements, costs and lead times require written confirmation.
  • 4. Traceability & Documentation: Request conformity certificates, traceability records or test reports before ordering. Document availability, issuer and coverage must be confirmed for the offered goods.
  • 5. Environmental Compliance: RoHS and REACH information is based on applicable manufacturer documentation. Confirm the exact part, declaration date and relevant exemptions before ordering.
  • 6. Handling & Protection: Handling, storage and packaging follow applicable product requirements, including ESD and moisture protection where required. Special handling requirements must be agreed before ordering.
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Product FAQ
Purchasing FAQ

What type of component is W25B40VSNIG, and what package does it use?

W25B40VSNIG is an authentic electronic component manufactured by Winbond, categorized under Memory IC Development Tools. It is supplied in the standard manufacturer-specified package footprint, providing industry-standard mechanical dimensions and terminal configurations for board-level assembly. Full pinout configurations, physical footprint drawings, and rated operating tolerances are documented in the official W25B40VSNIG datasheet above.

Why is pricing for W25B40VSNIG available via RFQ rather than a fixed checkout price?

Electronic component spot-market pricing for W25B40VSNIG fluctuates based on real-time global availability, production date codes, minimum order quantities (MOQ), and packaging formats (e.g., Reel, Tube, Tray). Using an RFQ ensures you receive accurate, real-time volume pricing tied to verified, traceable inventory rather than stale catalog estimates.

How quickly can W25B40VSNIG be shipped once quoted?

Lead times for W25B40VSNIG depend on whether stock is dispatched from our central hub or regional franchise partners. Ready-to-ship inventory typically leaves the warehouse within 1–3 business days following quality inspection, while factory-direct or back-ordered allocations are confirmed with an estimated ship date upon RFQ reply.

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