
| Type | Description | ||
|---|---|---|---|
| Rohs Code | Yes | Part Life Cycle Code | Transferred |
| Package Description | 12 X 12 MM, 1.80 MM PITCH, ROHS COMPLIANT, LFBGA-172 | Reach Compliance Code | compliant |
| HTS Code | 8542.39.00.01 | Consumer IC Type | CONSUMER CIRCUIT |
| JESD-30 Code | S-PBGA-B172 | Number of Functions | 1 |
| Number of Terminals | 172 | Package Body Material | PLASTIC/EPOXY |
| Package Code | BGA | Package Shape | SQUARE |
| Package Style | GRID ARRAY | Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Surface Mount | YES | Terminal Form | BALL |
| Terminal Position | BOTTOM | Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
YG GROUP (YUGUANG INTERNATIONAL(HK)CO.,LTD) supports reliable sourcing through quality controls and compliance documentation. Please confirm product requirements, applicable certifications and supporting documents before ordering.
STDP4320-BA is an authentic electronic component manufactured by STMicroelectronics, categorized under Multimedia ICs. It is supplied in the standard manufacturer-specified package footprint, providing industry-standard mechanical dimensions and terminal configurations for board-level assembly. Full pinout configurations, physical footprint drawings, and rated operating tolerances are documented in the official STDP4320-BA datasheet above.
Electronic component spot-market pricing for STDP4320-BA fluctuates based on real-time global availability, production date codes, minimum order quantities (MOQ), and packaging formats (e.g., Reel, Tube, Tray). Using an RFQ ensures you receive accurate, real-time volume pricing tied to verified, traceable inventory rather than stale catalog estimates.
Lead times for STDP4320-BA depend on whether stock is dispatched from our central hub or regional franchise partners. Ready-to-ship inventory typically leaves the warehouse within 1–3 business days following quality inspection, while factory-direct or back-ordered allocations are confirmed with an estimated ship date upon RFQ reply.
Loading articles…
Loading articles…

Design with TI BQ25756RRVR 70V bidirectional buck-boost charger controller: external USB-C PD pairing, MPPT solar limits, and 4-FETs. Request a quote.
Read more →
Evaluate NXP MIMX9352CVVXMAC i.MX 93 MPU (1.7GHz Cortex-A55, 0.5 TOPS NPU, 11x11 BGA) thermal grade and part-number decoding. Request a quote today.
Read more →
Audit Microchip ATMEGA328P-AU TQFP-32 8-bit AVR MCU fuse bits, BOD thresholds, and -AN/-U/PB suffix differences before substitution. Request an RFQ.
Read more →
Compare Realtek RTL8126-CG 5GbE PCIe 3.0 x1 QFN-32 controller specs against RTL8125BG-CG, thermal pad vias, and power rails. Submit your BOM for RFQ.
Read more →Loading related products…
| Picture | Part Number | Manufacturer | PDF / RoHS | Stock | Action |
|---|---|---|---|---|---|
| STMicroelectronics | - | 5,670 | |||
| STMicroelectronics | - | 4,190 | |||
| STMicroelectronics | -- | 2,030 | |||
| STMicroelectronics | 8,680 | ||||
| STMicroelectronics | - | 6,910 | |||
| STMicroelectronics | -- | 3,790 | |||
| STMicroelectronics | - | 5,040 | |||
| STMicroelectronics | -- | 4,380 | |||
| STMicroelectronics | - | 5,980 | |||
| STMicroelectronics | 2,320 |