
W25N01GVZEIG: 1Gb NAND ECC and Bad-Block Management
W25N01GVZEIG is a Winbond 1Gb 3V SPI NAND flash with 1-bit ECC in 8x6mm WSON. Preserve bad-block markers and G-suffix BUF mode. Request a quote today.
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| Type | Description | ||
|---|---|---|---|
| Series | PowerTrench® | Packaging | Tape & Reel (TR) |
| Part Status | Obsolete | Manufacturer Lead Time | 1 Weeks |
| Configuration | N and P-Channel | Current - Continuous Drain (Id) @ 25°C | 2.5A (Ta), 2A (Ta) |
| Drain to Source Voltage (Vdss) | 30V | Gate Charge (Qg) (Max) @ Vgs | 6.6nC @ 10V, 5.7nC @ 10V |
| Input Capacitance (Ciss) (Max) @ Vds | 282pF @ 15V, 185pF @ 15V | Mounting Type | Surface Mount |
| Operating Temperature | -55°C ~ 150°C (TJ) | Package / Case | SOT-23-6 Thin, TSOT-23-6 |
| Power - Max | 700mW (Ta) | Rds On (Max) @ Id, Vgs | 95mOhm @ 2.5A, 10V, 130mOhm @ 2A, 10V |
| Supplier Device Package | SuperSOT™-6 | Technology | MOSFET (Metal Oxide) |
| Vgs(th) (Max) @ Id | 3V @ 250µA | ExportControlClassNumber | EAR99 |
| HtsusCode | 8541.21.0095 | MoistureSensitivityLevel | 1 (Unlimited) |
YG GROUP (YUGUANG INTERNATIONAL(HK)CO.,LTD) supports reliable sourcing through quality controls and compliance documentation. Please confirm product requirements, applicable certifications and supporting documents before ordering.
FDC6333C-G is an authentic electronic component manufactured by onsemi, categorized under Transistors. It is supplied in the standard manufacturer-specified package footprint, providing industry-standard mechanical dimensions and terminal configurations for board-level assembly. Full pinout configurations, physical footprint drawings, and rated operating tolerances are documented in the official FDC6333C-G datasheet above.
Electronic component spot-market pricing for FDC6333C-G fluctuates based on real-time global availability, production date codes, minimum order quantities (MOQ), and packaging formats (e.g., Reel, Tube, Tray). Using an RFQ ensures you receive accurate, real-time volume pricing tied to verified, traceable inventory rather than stale catalog estimates.
Lead times for FDC6333C-G depend on whether stock is dispatched from our central hub or regional franchise partners. Ready-to-ship inventory typically leaves the warehouse within 1–3 business days following quality inspection, while factory-direct or back-ordered allocations are confirmed with an estimated ship date upon RFQ reply.
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W25N01GVZEIG is a Winbond 1Gb 3V SPI NAND flash with 1-bit ECC in 8x6mm WSON. Preserve bad-block markers and G-suffix BUF mode. Request a quote today.
Read more →
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| onsemi | 8,800 | ||||
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