
This EVB supports the NXP® MPC56xxS microprocessors for automotive instrumentation clusters. It consists of an XPC56XXMPB2 Motherboard and an XPC560SADPT Mini-Module that plugs into the motherboard.
We recommend ordering all together using the "SKIT" part numbers; remember to order the MCU separately.
Different Mini-Modules are available for evaluating devices with different footprints in the MPC56xxS-family of microprocessors. The evaluation system allows full access to the CPU, all of the CPU’s I/O signals, and the motherboard peripherals. The Mini-Module may be used as a standalone unit, which allows access to the CPU, but without access to the I/O pins or any motherboard peripherals.
YG GROUP (YUGUANG INTERNATIONAL(HK)CO.,LTD) supports reliable sourcing through quality controls and compliance documentation. Please confirm product requirements, applicable certifications and supporting documents before ordering.
XPC560SADPT208S is an authentic electronic component manufactured by NXP, categorized under Development Tools. It is supplied in the standard manufacturer-specified package footprint, providing industry-standard mechanical dimensions and terminal configurations for board-level assembly. Full pinout configurations, physical footprint drawings, and rated operating tolerances are documented in the official XPC560SADPT208S datasheet above.
Electronic component spot-market pricing for XPC560SADPT208S fluctuates based on real-time global availability, production date codes, minimum order quantities (MOQ), and packaging formats (e.g., Reel, Tube, Tray). Using an RFQ ensures you receive accurate, real-time volume pricing tied to verified, traceable inventory rather than stale catalog estimates.
Lead times for XPC560SADPT208S depend on whether stock is dispatched from our central hub or regional franchise partners. Ready-to-ship inventory typically leaves the warehouse within 1–3 business days following quality inspection, while factory-direct or back-ordered allocations are confirmed with an estimated ship date upon RFQ reply.
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