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  5. /MGD3100BM38EKR2
MGD3100BM38EKR2 thumbnail 1

MGD3100BM38EKR2

Category
Interface ICs
Manufacturer
NXPDetails
RoHS Status
Datasheet
Description
IC GATE DRVR HALF-BRIDGE 32BSSOP.Half-Bridge Gate Driver IC 32-SOIC
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Quality Control
Authentic & Traceable
Shipping (In-stock)
1-3 business days
Quote Response
Within 24 Hours
Stock Status7680
QuantityMGD3100BM38EKR2
Country

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Specification
Documentation
TypeDescriptionTypeDescription
PackagingTape & Reel (TR)Part StatusActive
Manufacturer Lead Time99 WeeksChannel TypeSingle
Current - Peak Output (Source, Sink)15A, 15ADriven ConfigurationHalf-Bridge
Gate TypeIGBT, MOSFET (N-Channel)GradeAutomotive
Mounting TypeSurface MountNumber of Drivers1
Operating Temperature-40°C ~ 125°C (TA)Package / Case32-BSSOP (0.295", 7.50mm Width)
QualificationAEC-Q100Supplier Device Package32-SOIC
Voltage - Supply3.3VExportControlClassNumberEAR99
HtsusCode8542.39.0060MoistureSensitivityLevel3 (168 Hours)
ReachStatusREACH UnaffectedRoHS StatusRoHS Compliant
Certified Quality & Compliance
Purchase & Inquiry
Secure Packaging
Shipping & Availability
Payment

YG GROUP (YUGUANG INTERNATIONAL(HK)CO.,LTD) supports reliable sourcing through quality controls and compliance documentation. Please confirm product requirements, applicable certifications and supporting documents before ordering.

  • 1. Certification Scope: Quality certifications apply only to the entities, sites and activities listed in valid certificates. Management system certification does not certify each individual product.
  • 2. Product Authenticity: Products must match the agreed manufacturer, part number and condition. Supplier screening and authenticity checks help reduce counterfeit risk.
  • 3. Inspection & Testing: The inspection scope follows product risks and agreed requirements. Additional testing, laboratory arrangements, costs and lead times require written confirmation.
  • 4. Traceability & Documentation: Request conformity certificates, traceability records or test reports before ordering. Document availability, issuer and coverage must be confirmed for the offered goods.
  • 5. Environmental Compliance: RoHS and REACH information is based on applicable manufacturer documentation. Confirm the exact part, declaration date and relevant exemptions before ordering.
  • 6. Handling & Protection: Handling, storage and packaging follow applicable product requirements, including ESD and moisture protection where required. Special handling requirements must be agreed before ordering.
ERAI
ISO 9001
ESD Control

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Product FAQ
Purchasing FAQ

What type of component is MGD3100BM38EKR2, and what package does it use?

MGD3100BM38EKR2 is an authentic electronic component manufactured by NXP, categorized under Interface ICs. It is supplied in the standard manufacturer-specified package footprint, providing industry-standard mechanical dimensions and terminal configurations for board-level assembly. Full pinout configurations, physical footprint drawings, and rated operating tolerances are documented in the official MGD3100BM38EKR2 datasheet above.

Why is dynamic quotation used instead of a fixed price for MGD3100BM38EKR2?

Electronic component spot-market pricing for MGD3100BM38EKR2 fluctuates based on real-time global availability, production date codes, minimum order quantities (MOQ), and packaging formats (e.g., Reel, Tube, Tray). Using an RFQ ensures you receive accurate, real-time volume pricing tied to verified, traceable inventory rather than stale catalog estimates.

What is the delivery timeline after placing an order for MGD3100BM38EKR2?

Lead times for MGD3100BM38EKR2 depend on whether stock is dispatched from our central hub or regional franchise partners. Ready-to-ship inventory typically leaves the warehouse within 1–3 business days following quality inspection, while factory-direct or back-ordered allocations are confirmed with an estimated ship date upon RFQ reply.

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