
| Type | Description | ||
|---|---|---|---|
| Series | HC11 | Packaging | Tube |
| Part Status | Obsolete | Manufacturer Lead Time | 52 Weeks |
| Connectivity | SCI, SPI | Core Processor | HC11 |
| Core Size | 8-Bit | Data Converters | A/D 8x8b |
| EEPROM Size | 512 x 8 | Mounting Type | Surface Mount |
| Number of I/O | 38 | Operating Temperature | -40°C ~ 85°C (TA) |
| Oscillator Type | Internal | Package / Case | 52-LCC (J-Lead) |
| Peripherals | POR, WDT | Program Memory Size | 20KB (20K x 8) |
| Program Memory Type | OTP | RAM Size | 768 x 8 |
| Speed | 3MHz | Supplier Device Package | 52-PLCC (19.1x19.1) |
YG GROUP (YUGUANG INTERNATIONAL(HK)CO.,LTD) supports reliable sourcing through quality controls and compliance documentation. Please confirm product requirements, applicable certifications and supporting documents before ordering.
MC68711E20CFNE3 is an authentic electronic component manufactured by NXP, categorized under Interface ICs. It is supplied in the standard manufacturer-specified package footprint, providing industry-standard mechanical dimensions and terminal configurations for board-level assembly. Full pinout configurations, physical footprint drawings, and rated operating tolerances are documented in the official MC68711E20CFNE3 datasheet above.
Electronic component spot-market pricing for MC68711E20CFNE3 fluctuates based on real-time global availability, production date codes, minimum order quantities (MOQ), and packaging formats (e.g., Reel, Tube, Tray). Using an RFQ ensures you receive accurate, real-time volume pricing tied to verified, traceable inventory rather than stale catalog estimates.
Lead times for MC68711E20CFNE3 depend on whether stock is dispatched from our central hub or regional franchise partners. Ready-to-ship inventory typically leaves the warehouse within 1–3 business days following quality inspection, while factory-direct or back-ordered allocations are confirmed with an estimated ship date upon RFQ reply.
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