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  1. Home
  2. /Products
  3. /Integrated Circuits - ICs
  4. /Interface ICs
  5. /MC56F8365MFGE
MC56F8365MFGE thumbnail 1
NXP

MC56F8365MFGE

Category
Interface ICs
Manufacturer
NXPDetails
RoHS Status
Datasheet
Description
IC MCU 16BIT 512KB FLASH 128LQFP.56800E 56F8xxx Microcontroller IC 16-Bit 60MHz 512KB (256K x 16) FLASH 128-LQFP (14x20)
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Quality Control
Authentic & Traceable
Shipping (In-stock)
1-3 business days
Quote Response
Within 24 Hours
Stock Status3980
QuantityMC56F8365MFGE
Country

Get Tiered Pricing (Submit RFQ)

Specification
Documentation
TypeDescriptionTypeDescription
Series56F8xxxPackagingTray
Part StatusObsoleteManufacturer Lead Time35 Weeks
ConnectivityCANbus, EBI/EMI, SCI, SPICore Processor56800E
Core Size16-BitData ConvertersA/D 16x12b
Mounting TypeSurface MountNumber of I/O49
Operating Temperature-40°C ~ 125°C (TA)Oscillator TypeExternal
Package / Case128-LQFPPeripheralsPOR, PWM, Temp Sensor, WDT
Program Memory Size512KB (256K x 16)Program Memory TypeFLASH
RAM Size18K x 16Speed60MHz
Supplier Device Package128-LQFP (14x20)Voltage - Supply (Vcc/Vdd)2.25V ~ 3.6V
Certified Quality & Compliance
Purchase & Inquiry
Secure Packaging
Shipping & Availability
Payment

YG GROUP (YUGUANG INTERNATIONAL(HK)CO.,LTD) supports reliable sourcing through quality controls and compliance documentation. Please confirm product requirements, applicable certifications and supporting documents before ordering.

  • 1. Certification Scope: Quality certifications apply only to the entities, sites and activities listed in valid certificates. Management system certification does not certify each individual product.
  • 2. Product Authenticity: Products must match the agreed manufacturer, part number and condition. Supplier screening and authenticity checks help reduce counterfeit risk.
  • 3. Inspection & Testing: The inspection scope follows product risks and agreed requirements. Additional testing, laboratory arrangements, costs and lead times require written confirmation.
  • 4. Traceability & Documentation: Request conformity certificates, traceability records or test reports before ordering. Document availability, issuer and coverage must be confirmed for the offered goods.
  • 5. Environmental Compliance: RoHS and REACH information is based on applicable manufacturer documentation. Confirm the exact part, declaration date and relevant exemptions before ordering.
  • 6. Handling & Protection: Handling, storage and packaging follow applicable product requirements, including ESD and moisture protection where required. Special handling requirements must be agreed before ordering.
ERAI
ISO 9001
ESD Control

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Product FAQ
Purchasing FAQ

What type of component is MC56F8365MFGE, and what package does it use?

MC56F8365MFGE is an authentic electronic component manufactured by NXP, categorized under Interface ICs. It is supplied in the standard manufacturer-specified package footprint, providing industry-standard mechanical dimensions and terminal configurations for board-level assembly. Full pinout configurations, physical footprint drawings, and rated operating tolerances are documented in the official MC56F8365MFGE datasheet above.

Why is dynamic quotation used instead of a fixed price for MC56F8365MFGE?

Electronic component spot-market pricing for MC56F8365MFGE fluctuates based on real-time global availability, production date codes, minimum order quantities (MOQ), and packaging formats (e.g., Reel, Tube, Tray). Using an RFQ ensures you receive accurate, real-time volume pricing tied to verified, traceable inventory rather than stale catalog estimates.

What is the delivery timeline after placing an order for MC56F8365MFGE?

Lead times for MC56F8365MFGE depend on whether stock is dispatched from our central hub or regional franchise partners. Ready-to-ship inventory typically leaves the warehouse within 1–3 business days following quality inspection, while factory-direct or back-ordered allocations are confirmed with an estimated ship date upon RFQ reply.

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