
| Type | Description | ||
|---|---|---|---|
| Series | LPC1100L | Packaging | Tray |
| Part Status | Active | Manufacturer Lead Time | 13 Weeks |
| Connectivity | I2C, SPI, UART/USART | Core Processor | ARM® Cortex®-M0 |
| Core Size | 32-Bit | Data Converters | A/D 8x10b |
| Mounting Type | Surface Mount | Number of I/O | 28 |
| Operating Temperature | -40°C ~ 85°C (TA) | Oscillator Type | Internal |
| Package / Case | 32-VFQFN Exposed Pad | Peripherals | Brown-out Detect/Reset, POR, WDT |
| Program Memory Size | 32KB (32K x 8) | Program Memory Type | FLASH |
| RAM Size | 8K x 8 | Speed | 50MHz |
| Supplier Device Package | 32-HVQFN (5x5) | Voltage - Supply (Vcc/Vdd) | 1.8V ~ 3.6V |
YG GROUP (YUGUANG INTERNATIONAL(HK)CO.,LTD) supports reliable sourcing through quality controls and compliance documentation. Please confirm product requirements, applicable certifications and supporting documents before ordering.
LPC1114FHI33/302,5 is an authentic electronic component manufactured by NXP, categorized under Interface ICs. It is supplied in the standard manufacturer-specified package footprint, providing industry-standard mechanical dimensions and terminal configurations for board-level assembly. Full pinout configurations, physical footprint drawings, and rated operating tolerances are documented in the official LPC1114FHI33/302,5 datasheet above.
Electronic component spot-market pricing for LPC1114FHI33/302,5 fluctuates based on real-time global availability, production date codes, minimum order quantities (MOQ), and packaging formats (e.g., Reel, Tube, Tray). Using an RFQ ensures you receive accurate, real-time volume pricing tied to verified, traceable inventory rather than stale catalog estimates.
Lead times for LPC1114FHI33/302,5 depend on whether stock is dispatched from our central hub or regional franchise partners. Ready-to-ship inventory typically leaves the warehouse within 1–3 business days following quality inspection, while factory-direct or back-ordered allocations are confirmed with an estimated ship date upon RFQ reply.
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