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  1. Home
  2. /Products
  3. /Wireless & RF Semiconductors
  4. /Wireless & RF Integrated Circuits
  5. /BGM1013
BGM1013 thumbnail 1
NXP

BGM1013

Category
Wireless & RF Integrated Circuits
Manufacturer
NXPDetails
Datasheet
—
Description
27.9dB 4.5V~5.5V 4.9dB SOT-363 RF Amplifiers ROHS
Similar Products
—
Quality Control
Authentic & Traceable
Shipping (In-stock)
1-3 business days
Quote Response
Within 24 Hours
Stock Status4200
QuantityBGM1013
Country

Get Tiered Pricing (Submit RFQ)

Specification
TypeDescriptionTypeDescription
PackageSOT-363Gain27.9dB
Voltage - Supply4.5V~5.5VNoise Figure4.9dB
CNHTS8542339000USHTS8542330001
TARIC8542339000CAHTS8542330000
BRHTS85423390INHTS85423300
MXHTS8542.33.99
Certified Quality & Compliance
Purchase & Inquiry
Secure Packaging
Shipping & Availability
Payment

YG GROUP (YUGUANG INTERNATIONAL(HK)CO.,LTD) supports reliable sourcing through quality controls and compliance documentation. Please confirm product requirements, applicable certifications and supporting documents before ordering.

  • 1. Certification Scope: Quality certifications apply only to the entities, sites and activities listed in valid certificates. Management system certification does not certify each individual product.
  • 2. Product Authenticity: Products must match the agreed manufacturer, part number and condition. Supplier screening and authenticity checks help reduce counterfeit risk.
  • 3. Inspection & Testing: The inspection scope follows product risks and agreed requirements. Additional testing, laboratory arrangements, costs and lead times require written confirmation.
  • 4. Traceability & Documentation: Request conformity certificates, traceability records or test reports before ordering. Document availability, issuer and coverage must be confirmed for the offered goods.
  • 5. Environmental Compliance: RoHS and REACH information is based on applicable manufacturer documentation. Confirm the exact part, declaration date and relevant exemptions before ordering.
  • 6. Handling & Protection: Handling, storage and packaging follow applicable product requirements, including ESD and moisture protection where required. Special handling requirements must be agreed before ordering.
ERAI
ISO 9001
ESD Control

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Product FAQ
Purchasing FAQ

What type of component is BGM1013, and what package does it use?

BGM1013 is an authentic electronic component manufactured by NXP, categorized under Wireless & RF Integrated Circuits. It is supplied in the standard SOT-363 package footprint, providing industry-standard mechanical dimensions and terminal configurations for board-level assembly. Full pinout configurations, physical footprint drawings, and rated operating tolerances are documented in the official BGM1013 datasheet above.

Why is pricing for BGM1013 available via RFQ rather than a fixed checkout price?

Electronic component spot-market pricing for BGM1013 fluctuates based on real-time global availability, production date codes, minimum order quantities (MOQ), and packaging formats (e.g., Reel, Tube, Tray). Using an RFQ ensures you receive accurate, real-time volume pricing tied to verified, traceable inventory rather than stale catalog estimates.

How quickly can BGM1013 be shipped once quoted?

Lead times for BGM1013 depend on whether stock is dispatched from our central hub or regional franchise partners. Ready-to-ship inventory typically leaves the warehouse within 1–3 business days following quality inspection, while factory-direct or back-ordered allocations are confirmed with an estimated ship date upon RFQ reply.

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