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  1. Home
  2. /Products
  3. /Integrated Circuits - ICs
  4. /Interface ICs
  5. /NAND256W3A2BZA6E
NAND256W3A2BZA6E thumbnail 1
Micron

NAND256W3A2BZA6E

Category
Interface ICs
Manufacturer
MicronDetails
RoHS Status
Datasheet
—
Description
IC FLASH 256MBIT PAR 55VFBGA.FLASH - NAND Memory IC 256Mbit Parallel 50 ns 55-VFBGA (8x10)
Similar Products
—
Quality Control
Authentic & Traceable
Shipping (In-stock)
1-3 business days
Quote Response
Within 24 Hours
Stock Status9730
QuantityNAND256W3A2BZA6E
Country

Get Tiered Pricing (Submit RFQ)

Specification
TypeDescriptionTypeDescription
PackagingTrayPart StatusObsolete
Access Time50 nsMemory FormatFLASH
Memory InterfaceParallelMemory Organization32M x 8
Memory Size256MbitMemory TypeNon-Volatile
Mounting TypeSurface MountOperating Temperature-40°C ~ 85°C (TA)
Package / Case55-TFBGASupplier Device Package55-VFBGA (8x10)
TechnologyFLASH - NANDVoltage - Supply2.7V ~ 3.6V
Write Cycle Time - Word, Page50nsExportControlClassNumber3A991B1A
HtsusCode8542.32.0071MoistureSensitivityLevel3 (168 Hours)
ReachStatusREACH UnaffectedRoHS StatusRoHS Compliant
Certified Quality & Compliance
Purchase & Inquiry
Secure Packaging
Shipping & Availability
Payment

YG GROUP (YUGUANG INTERNATIONAL(HK)CO.,LTD) supports reliable sourcing through quality controls and compliance documentation. Please confirm product requirements, applicable certifications and supporting documents before ordering.

  • 1. Certification Scope: Quality certifications apply only to the entities, sites and activities listed in valid certificates. Management system certification does not certify each individual product.
  • 2. Product Authenticity: Products must match the agreed manufacturer, part number and condition. Supplier screening and authenticity checks help reduce counterfeit risk.
  • 3. Inspection & Testing: The inspection scope follows product risks and agreed requirements. Additional testing, laboratory arrangements, costs and lead times require written confirmation.
  • 4. Traceability & Documentation: Request conformity certificates, traceability records or test reports before ordering. Document availability, issuer and coverage must be confirmed for the offered goods.
  • 5. Environmental Compliance: RoHS and REACH information is based on applicable manufacturer documentation. Confirm the exact part, declaration date and relevant exemptions before ordering.
  • 6. Handling & Protection: Handling, storage and packaging follow applicable product requirements, including ESD and moisture protection where required. Special handling requirements must be agreed before ordering.
ERAI
ISO 9001
ESD Control

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Product FAQ
Purchasing FAQ

What type of component is NAND256W3A2BZA6E, and what package does it use?

NAND256W3A2BZA6E is an authentic electronic component manufactured by Micron, categorized under Interface ICs. It is supplied in the standard manufacturer-specified package footprint, providing industry-standard mechanical dimensions and terminal configurations for board-level assembly. Full pinout configurations, physical footprint drawings, and rated operating tolerances are documented in the official NAND256W3A2BZA6E datasheet above.

Why is pricing for NAND256W3A2BZA6E available via RFQ rather than a fixed checkout price?

Electronic component spot-market pricing for NAND256W3A2BZA6E fluctuates based on real-time global availability, production date codes, minimum order quantities (MOQ), and packaging formats (e.g., Reel, Tube, Tray). Using an RFQ ensures you receive accurate, real-time volume pricing tied to verified, traceable inventory rather than stale catalog estimates.

How quickly can NAND256W3A2BZA6E be shipped once quoted?

Lead times for NAND256W3A2BZA6E depend on whether stock is dispatched from our central hub or regional franchise partners. Ready-to-ship inventory typically leaves the warehouse within 1–3 business days following quality inspection, while factory-direct or back-ordered allocations are confirmed with an estimated ship date upon RFQ reply.

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