
| Type | Description | ||
|---|---|---|---|
| Component Density | 1Gb | Speed | 333MHz |
| MT/s | 666MTPS | I/O Voltage | 1.8 VOLTS |
| Operating Temp | 0C to +85C | Bus Width | x16 |
| CAS Latency | CL = 5 | Pin Count | 84-ball |
| Part Status Code | Obsolete | Component Config | 64Mb x16 |
| Dry Pack Qty | 1000 | Package Dimension (W x L x H) mm | 8.00 x 12.50 x 1.20 |
| Tape & Reel Qty | 1000 | Number of Components | 1 |
| Technology | DDR2 | Package | FBGA |
| Family | DRAM |
YG GROUP (YUGUANG INTERNATIONAL(HK)CO.,LTD) supports reliable sourcing through quality controls and compliance documentation. Please confirm product requirements, applicable certifications and supporting documents before ordering.
MT47H64M16HW-3:H is an authentic electronic component manufactured by Micron, categorized under DRAM. It is supplied in the standard FBGA package footprint, providing industry-standard mechanical dimensions and terminal configurations for board-level assembly. Full pinout configurations, physical footprint drawings, and rated operating tolerances are documented in the official MT47H64M16HW-3:H datasheet above.
Electronic component spot-market pricing for MT47H64M16HW-3:H fluctuates based on real-time global availability, production date codes, minimum order quantities (MOQ), and packaging formats (e.g., Reel, Tube, Tray). Using an RFQ ensures you receive accurate, real-time volume pricing tied to verified, traceable inventory rather than stale catalog estimates.
Lead times for MT47H64M16HW-3:H depend on whether stock is dispatched from our central hub or regional franchise partners. Ready-to-ship inventory typically leaves the warehouse within 1–3 business days following quality inspection, while factory-direct or back-ordered allocations are confirmed with an estimated ship date upon RFQ reply.
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