
The SST13LP05 is a fully matched, dual-band power amplifier module (PAM) based on the highly-reliable InGaP/GaAs HBT technology. This PAM provides excellent RF performance, temperature-stable power detectors, and low-current analog on/off control interfaces. The SST13LP05 provides stable RF and power detector performance over a large VCC power supply variation, with an ultra-low shut-down current. The SST13LP05 is ideal for the final stage power amplification in both battery-powered 802.11a/b/g WLAN transmitters and access point applications.
YG GROUP (YUGUANG INTERNATIONAL(HK)CO.,LTD) supports reliable sourcing through quality controls and compliance documentation. Please confirm product requirements, applicable certifications and supporting documents before ordering.
SST13LP05 is an authentic electronic component manufactured by Microchip, categorized under Wireless & RF Integrated Circuits. It is supplied in the standard manufacturer-specified package footprint, providing industry-standard mechanical dimensions and terminal configurations for board-level assembly. Full pinout configurations, physical footprint drawings, and rated operating tolerances are documented in the official SST13LP05 datasheet above.
Electronic component spot-market pricing for SST13LP05 fluctuates based on real-time global availability, production date codes, minimum order quantities (MOQ), and packaging formats (e.g., Reel, Tube, Tray). Using an RFQ ensures you receive accurate, real-time volume pricing tied to verified, traceable inventory rather than stale catalog estimates.
Lead times for SST13LP05 depend on whether stock is dispatched from our central hub or regional franchise partners. Ready-to-ship inventory typically leaves the warehouse within 1–3 business days following quality inspection, while factory-direct or back-ordered allocations are confirmed with an estimated ship date upon RFQ reply.
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