
| Type | Description | ||
|---|---|---|---|
| Series | PIC® XLP™ 18J | Packaging | Tube |
| Part Status | Active | Manufacturer Lead Time | 59 Weeks |
| Connectivity | I2C, SPI, UART/USART | Core Processor | PIC |
| Core Size | 8-Bit | Data Converters | A/D 10x10b |
| Mounting Type | Surface Mount | Number of I/O | 16 |
| Operating Temperature | -40°C ~ 85°C (TA) | Oscillator Type | Internal |
| Package / Case | 28-VQFN Exposed Pad | Peripherals | Brown-out Detect/Reset, POR, PWM, WDT |
| Program Memory Size | 32KB (16K x 16) | Program Memory Type | FLASH |
| RAM Size | 3.8K x 8 | Speed | 48MHz |
| Supplier Device Package | 28-QFN (6x6) | Voltage - Supply (Vcc/Vdd) | 2V ~ 3.6V |
YG GROUP (YUGUANG INTERNATIONAL(HK)CO.,LTD) supports reliable sourcing through quality controls and compliance documentation. Please confirm product requirements, applicable certifications and supporting documents before ordering.
PIC18LF25J11-I/ML is an authentic electronic component manufactured by Microchip, categorized under Interface ICs. It is supplied in the standard manufacturer-specified package footprint, providing industry-standard mechanical dimensions and terminal configurations for board-level assembly. Full pinout configurations, physical footprint drawings, and rated operating tolerances are documented in the official PIC18LF25J11-I/ML datasheet above.
Electronic component spot-market pricing for PIC18LF25J11-I/ML fluctuates based on real-time global availability, production date codes, minimum order quantities (MOQ), and packaging formats (e.g., Reel, Tube, Tray). Using an RFQ ensures you receive accurate, real-time volume pricing tied to verified, traceable inventory rather than stale catalog estimates.
Lead times for PIC18LF25J11-I/ML depend on whether stock is dispatched from our central hub or regional franchise partners. Ready-to-ship inventory typically leaves the warehouse within 1–3 business days following quality inspection, while factory-direct or back-ordered allocations are confirmed with an estimated ship date upon RFQ reply.
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