
| Type | Description | ||
|---|---|---|---|
| Series | PIC® XLP™ 18K | Packaging | Tape & Reel (TR) |
| Part Status | Active | Manufacturer Lead Time | 47 Weeks |
| Connectivity | I2C, SPI, UART/USART | Core Processor | PIC |
| Core Size | 8-Bit | Data Converters | A/D 11x10b |
| EEPROM Size | 256 x 8 | Mounting Type | Surface Mount |
| Number of I/O | 24 | Operating Temperature | -40°C ~ 85°C (TA) |
| Oscillator Type | Internal | Package / Case | 28-UFQFN Exposed Pad |
| Peripherals | Brown-out Detect/Reset, HLVD, POR, PWM, WDT | Program Memory Size | 8KB (4K x 16) |
| Program Memory Type | FLASH | RAM Size | 512 x 8 |
| Speed | 64MHz | Supplier Device Package | 28-UQFN (4x4) |
YG GROUP (YUGUANG INTERNATIONAL(HK)CO.,LTD) supports reliable sourcing through quality controls and compliance documentation. Please confirm product requirements, applicable certifications and supporting documents before ordering.
PIC18F23K20T-I/MV is an authentic electronic component manufactured by Microchip, categorized under Interface ICs. It is supplied in the standard manufacturer-specified package footprint, providing industry-standard mechanical dimensions and terminal configurations for board-level assembly. Full pinout configurations, physical footprint drawings, and rated operating tolerances are documented in the official PIC18F23K20T-I/MV datasheet above.
Electronic component spot-market pricing for PIC18F23K20T-I/MV fluctuates based on real-time global availability, production date codes, minimum order quantities (MOQ), and packaging formats (e.g., Reel, Tube, Tray). Using an RFQ ensures you receive accurate, real-time volume pricing tied to verified, traceable inventory rather than stale catalog estimates.
Lead times for PIC18F23K20T-I/MV depend on whether stock is dispatched from our central hub or regional franchise partners. Ready-to-ship inventory typically leaves the warehouse within 1–3 business days following quality inspection, while factory-direct or back-ordered allocations are confirmed with an estimated ship date upon RFQ reply.
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