
W25N01GVZEIG: 1Gb NAND ECC and Bad-Block Management
W25N01GVZEIG is a Winbond 1Gb 3V SPI NAND flash with 1-bit ECC in 8x6mm WSON. Preserve bad-block markers and G-suffix BUF mode. Request a quote today.
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The PAS740x device family is Microsemi's second generation GPON ONT System-on-a-Chip (SoC) device family, dedicated for use in GPON (ITU-T G.984) networks. The PAS740x devices are optimized for building a high-performance, extremely low power and low cost GPON ONT in Single Family Unit (SFU), Multiple Dwelling Unit (MDU), or similar configurations. The PAS740x devices integrate GPON SERDES, MAC and packet processing functions, together with an integrated ARM926 controller, Gigabit Ethernet (GbE) user interfaces, a TDM interface, and a dedicated DSP for VoIP processing (on PAS7401V only).The PAS740x device family is based on Microsemi's field proven GigaPASS networking architecture, which provides marketleading throughput and quality of service (QoS). The PAS7401/7401V provide simultaneous, sustained 2 Gbit/s downstream and 1.244 Gbit/s upstream throughput at all packet sizes. The GigaPASS networking engine provides TR-101 compliant networking features, compliant with FSAN CTS specifications, including 802.1p/q bridging, packet classification, filtering and queuing, traffic shaping, and policing. PAS740x is provided with a comprehensive, turnkey-level software package which includes:
YG GROUP (YUGUANG INTERNATIONAL(HK)CO.,LTD) supports reliable sourcing through quality controls and compliance documentation. Please confirm product requirements, applicable certifications and supporting documents before ordering.
PAS7401 is an authentic electronic component manufactured by Microchip, categorized under Communication & Networking ICs. It is supplied in the standard manufacturer-specified package footprint, providing industry-standard mechanical dimensions and terminal configurations for board-level assembly. Full pinout configurations, physical footprint drawings, and rated operating tolerances are documented in the official PAS7401 datasheet above.
Electronic component spot-market pricing for PAS7401 fluctuates based on real-time global availability, production date codes, minimum order quantities (MOQ), and packaging formats (e.g., Reel, Tube, Tray). Using an RFQ ensures you receive accurate, real-time volume pricing tied to verified, traceable inventory rather than stale catalog estimates.
Lead times for PAS7401 depend on whether stock is dispatched from our central hub or regional franchise partners. Ready-to-ship inventory typically leaves the warehouse within 1–3 business days following quality inspection, while factory-direct or back-ordered allocations are confirmed with an estimated ship date upon RFQ reply.
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W25N01GVZEIG is a Winbond 1Gb 3V SPI NAND flash with 1-bit ECC in 8x6mm WSON. Preserve bad-block markers and G-suffix BUF mode. Request a quote today.
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| Picture | Part Number | Manufacturer | PDF / RoHS | Stock | Action |
|---|---|---|---|---|---|
| Microchip | 2,160 | ||||
| Microchip | 8,510 | ||||
| Microchip | 6,470 | ||||
| Microchip | -- | 5,820 | |||
| Microchip | 7,300 | ||||
| Microchip | -- | 9,720 | |||
| Microchip | 2,710 | ||||
| Microchip | 2,000 | ||||
| Microchip | 6,570 | ||||
| Microchip | 3,020 |