
| Type | Description | ||
|---|---|---|---|
| Baud Rate Max [kbit/s] | 20 | TempRange [°C] Max | 125 |
| Vin Max (V) | 18 | Vin Min (V) | 5.5 |
| Wake Pin | Yes | Watchdog | No |
| Wettable Flanks | No | Integrated VREG | Yes |
| Lead Count (Pins) | 14 | Package Type | SOIC |
| Temperature Range | -40C to +125C | Packing Media | TUBE |
| 5K Pricing | $1.57 |
YG GROUP (YUGUANG INTERNATIONAL(HK)CO.,LTD) supports reliable sourcing through quality controls and compliance documentation. Please confirm product requirements, applicable certifications and supporting documents before ordering.
MCP2022-330E/SL is an authentic electronic component manufactured by Microchip, categorized under Interface ICs. It is supplied in the standard manufacturer-specified package footprint, providing industry-standard mechanical dimensions and terminal configurations for board-level assembly. Full pinout configurations, physical footprint drawings, and rated operating tolerances are documented in the official MCP2022-330E/SL datasheet above.
Electronic component spot-market pricing for MCP2022-330E/SL fluctuates based on real-time global availability, production date codes, minimum order quantities (MOQ), and packaging formats (e.g., Reel, Tube, Tray). Using an RFQ ensures you receive accurate, real-time volume pricing tied to verified, traceable inventory rather than stale catalog estimates.
Lead times for MCP2022-330E/SL depend on whether stock is dispatched from our central hub or regional franchise partners. Ready-to-ship inventory typically leaves the warehouse within 1–3 business days following quality inspection, while factory-direct or back-ordered allocations are confirmed with an estimated ship date upon RFQ reply.
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