
| Type | Description | ||
|---|---|---|---|
| Package / Case | 256-LBGA | Surface Mount | YES |
| Number of Pins | 256 | Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray | Series | SmartFusion® |
| Published | 2015 | JESD-609 Code | e1 |
| Part Status | Obsolete | Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 256 | Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Technology | CMOS | Terminal Position | BOTTOM |
| Terminal Form | BALL | Peak Reflow Temperature (Cel) | 250 |
| Supply Voltage | 1.5V | Terminal Pitch | 1mm |
| Frequency | 100MHz | Time@Peak Reflow Temperature-Max (s) | 30 |
YG GROUP (YUGUANG INTERNATIONAL(HK)CO.,LTD) supports reliable sourcing through quality controls and compliance documentation. Please confirm product requirements, applicable certifications and supporting documents before ordering.
A2F060M3E-1FGG256I is an authentic electronic component manufactured by Microchip, categorized under Systems on a Chip - SoC. It is supplied in the standard manufacturer-specified package footprint, providing industry-standard mechanical dimensions and terminal configurations for board-level assembly. Full pinout configurations, physical footprint drawings, and rated operating tolerances are documented in the official A2F060M3E-1FGG256I datasheet above.
Electronic component spot-market pricing for A2F060M3E-1FGG256I fluctuates based on real-time global availability, production date codes, minimum order quantities (MOQ), and packaging formats (e.g., Reel, Tube, Tray). Using an RFQ ensures you receive accurate, real-time volume pricing tied to verified, traceable inventory rather than stale catalog estimates.
Lead times for A2F060M3E-1FGG256I depend on whether stock is dispatched from our central hub or regional franchise partners. Ready-to-ship inventory typically leaves the warehouse within 1–3 business days following quality inspection, while factory-direct or back-ordered allocations are confirmed with an estimated ship date upon RFQ reply.
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