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  1. Home
  2. /Products
  3. /Discrete Semiconductors
  4. /Discrete & Power Modules
  5. /BSM30GP60B2BOSA1
BSM30GP60B2BOSA1 thumbnail 1
Infineon

BSM30GP60B2BOSA1

Category
Discrete & Power Modules
Manufacturer
InfineonDetails
Datasheet
—
Description
—
Similar Products
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Quality Control
Authentic & Traceable
Shipping (In-stock)
1-3 business days
Quote Response
Within 24 Hours
Stock Status8390
QuantityBSM30GP60B2BOSA1
Country

Get Tiered Pricing (Submit RFQ)

Specification
Product Details
Key Features
Applications
TypeDescriptionTypeDescription
Mounting TypeChassis MountPackage / CaseModule
Operating Temperature-40°C~125°CPart StatusLast Time Buy
ConfigurationFull BridgePower - Max180W
InputThree Phase Bridge RectifierVoltage - Collector Emitter Breakdown (Max)600V
Current - Collector (Ic) (Max)50AVce(on) (Max) @ Vge, Ic2.45V @ 15V, 30A
NTC ThermistorYesInput Capacitance (Cies) @ Vce1.6nF @ 25V
Certified Quality & Compliance
Purchase & Inquiry
Secure Packaging
Shipping & Availability
Payment

YG GROUP (YUGUANG INTERNATIONAL(HK)CO.,LTD) supports reliable sourcing through quality controls and compliance documentation. Please confirm product requirements, applicable certifications and supporting documents before ordering.

  • 1. Certification Scope: Quality certifications apply only to the entities, sites and activities listed in valid certificates. Management system certification does not certify each individual product.
  • 2. Product Authenticity: Products must match the agreed manufacturer, part number and condition. Supplier screening and authenticity checks help reduce counterfeit risk.
  • 3. Inspection & Testing: The inspection scope follows product risks and agreed requirements. Additional testing, laboratory arrangements, costs and lead times require written confirmation.
  • 4. Traceability & Documentation: Request conformity certificates, traceability records or test reports before ordering. Document availability, issuer and coverage must be confirmed for the offered goods.
  • 5. Environmental Compliance: RoHS and REACH information is based on applicable manufacturer documentation. Confirm the exact part, declaration date and relevant exemptions before ordering.
  • 6. Handling & Protection: Handling, storage and packaging follow applicable product requirements, including ESD and moisture protection where required. Special handling requirements must be agreed before ordering.
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Product FAQ
Purchasing FAQ

What type of component is BSM30GP60B2BOSA1, and what package does it use?

BSM30GP60B2BOSA1 is an authentic electronic component manufactured by Infineon, categorized under Discrete & Power Modules. It is supplied in the standard manufacturer-specified package footprint, providing industry-standard mechanical dimensions and terminal configurations for board-level assembly. Full pinout configurations, physical footprint drawings, and rated operating tolerances are documented in the official BSM30GP60B2BOSA1 datasheet above.

Why is dynamic quotation used instead of a fixed price for BSM30GP60B2BOSA1?

Electronic component spot-market pricing for BSM30GP60B2BOSA1 fluctuates based on real-time global availability, production date codes, minimum order quantities (MOQ), and packaging formats (e.g., Reel, Tube, Tray). Using an RFQ ensures you receive accurate, real-time volume pricing tied to verified, traceable inventory rather than stale catalog estimates.

What is the delivery timeline after placing an order for BSM30GP60B2BOSA1?

Lead times for BSM30GP60B2BOSA1 depend on whether stock is dispatched from our central hub or regional franchise partners. Ready-to-ship inventory typically leaves the warehouse within 1–3 business days following quality inspection, while factory-direct or back-ordered allocations are confirmed with an estimated ship date upon RFQ reply.

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