
W25N01GVZEIG: 1Gb NAND ECC and Bad-Block Management
W25N01GVZEIG is a Winbond 1Gb 3V SPI NAND flash with 1-bit ECC in 8x6mm WSON. Preserve bad-block markers and G-suffix BUF mode. Request a quote today.
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| Type | Description | ||
|---|---|---|---|
| Manufacturer Part Number | H-832-2 | Packaging | Tray |
| Standard Pack Qty | 1 | CNHTS | 8543909000 |
| ECCN | EAR99 | TARIC | 8543709099 |
| USHTS | 8543704500 | Factory Lead Time | 98 Days |
YG GROUP (YUGUANG INTERNATIONAL(HK)CO.,LTD) supports reliable sourcing through quality controls and compliance documentation. Please confirm product requirements, applicable certifications and supporting documents before ordering.
H-832-2 is an authentic electronic component manufactured by Bourns, categorized under Encoders. It is supplied in the standard manufacturer-specified package footprint, providing industry-standard mechanical dimensions and terminal configurations for board-level assembly. Full pinout configurations, physical footprint drawings, and rated operating tolerances are documented in the official H-832-2 datasheet above.
Electronic component spot-market pricing for H-832-2 fluctuates based on real-time global availability, production date codes, minimum order quantities (MOQ), and packaging formats (e.g., Reel, Tube, Tray). Using an RFQ ensures you receive accurate, real-time volume pricing tied to verified, traceable inventory rather than stale catalog estimates.
Lead times for H-832-2 depend on whether stock is dispatched from our central hub or regional franchise partners. Ready-to-ship inventory typically leaves the warehouse within 1–3 business days following quality inspection, while factory-direct or back-ordered allocations are confirmed with an estimated ship date upon RFQ reply.
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W25N01GVZEIG is a Winbond 1Gb 3V SPI NAND flash with 1-bit ECC in 8x6mm WSON. Preserve bad-block markers and G-suffix BUF mode. Request a quote today.
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