
| Type | Description | ||
|---|---|---|---|
| RoHS Status | RoHS Compliant | Part Life Cycle Code | Active |
| Part Package Code | 8-SOIC_N-150_MIL | Pin Count | 8 |
| Manufacturer Package Code | 8-SOIC_N-150_MIL | Date Of Intro | 2005-02-18 |
| Differential Output | YES | Driver Number of Bits | 1 |
| JESD-30 Code | R-PDSO-G8 | JESD-609 Code | e3 |
| Moisture Sensitivity Level | 1 | Number of Terminals | 8 |
| Operating Temperature-Max | 125 °C | Operating Temperature-Min | -40 °C |
| Out Swing-Min | 2 V | Output Low Current-Max | 0.001 A |
| Package Body Material | PLASTIC/EPOXY | Package Code | SOP |
| Package Equivalence Code | SOP8,.25 | Package Shape | RECTANGULAR |
YG GROUP (YUGUANG INTERNATIONAL(HK)CO.,LTD) supports reliable sourcing through quality controls and compliance documentation. Please confirm product requirements, applicable certifications and supporting documents before ordering.
MAX13081EASA+T is an authentic electronic component manufactured by Analog Devices, categorized under Driver ICs. It is supplied in the standard manufacturer-specified package footprint, providing industry-standard mechanical dimensions and terminal configurations for board-level assembly. Full pinout configurations, physical footprint drawings, and rated operating tolerances are documented in the official MAX13081EASA+T datasheet above.
Electronic component spot-market pricing for MAX13081EASA+T fluctuates based on real-time global availability, production date codes, minimum order quantities (MOQ), and packaging formats (e.g., Reel, Tube, Tray). Using an RFQ ensures you receive accurate, real-time volume pricing tied to verified, traceable inventory rather than stale catalog estimates.
Lead times for MAX13081EASA+T depend on whether stock is dispatched from our central hub or regional franchise partners. Ready-to-ship inventory typically leaves the warehouse within 1–3 business days following quality inspection, while factory-direct or back-ordered allocations are confirmed with an estimated ship date upon RFQ reply.
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