
| Type | Description | ||
|---|---|---|---|
| Mounting Type | Surface Mount | Package / Case | 34-LPM |
| Surface Mount | YES | Number of Pins | 34 |
| Operating Temperature | -40°C~85°C TA | Packaging | Tube |
| Published | 2000 | Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | Number of Terminations | 34 |
| ECCN Code | EAR99 | Additional Feature | 10 YEAR DATA RETENTION PERIOD |
| HTS Code | 8542.32.00.41 | Technology | NVSRAM (Non-Volatile SRAM) |
| Voltage - Supply | 4.75V~5.25V | Terminal Position | DUAL |
| Peak Reflow Temperature (Cel) | 225 | Number of Functions | 1 |
| Supply Voltage | 5V | Terminal Pitch | 1.27mm |
YG GROUP (YUGUANG INTERNATIONAL(HK)CO.,LTD) supports reliable sourcing through quality controls and compliance documentation. Please confirm product requirements, applicable certifications and supporting documents before ordering.
DS1330BL-70IND is an authentic electronic component manufactured by Analog Devices, categorized under Memory IC Development Tools. It is supplied in the standard manufacturer-specified package footprint, providing industry-standard mechanical dimensions and terminal configurations for board-level assembly. Full pinout configurations, physical footprint drawings, and rated operating tolerances are documented in the official DS1330BL-70IND datasheet above.
Electronic component spot-market pricing for DS1330BL-70IND fluctuates based on real-time global availability, production date codes, minimum order quantities (MOQ), and packaging formats (e.g., Reel, Tube, Tray). Using an RFQ ensures you receive accurate, real-time volume pricing tied to verified, traceable inventory rather than stale catalog estimates.
Lead times for DS1330BL-70IND depend on whether stock is dispatched from our central hub or regional franchise partners. Ready-to-ship inventory typically leaves the warehouse within 1–3 business days following quality inspection, while factory-direct or back-ordered allocations are confirmed with an estimated ship date upon RFQ reply.
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