
| Type | Description | ||
|---|---|---|---|
| Series | Spartan® UltraScale+™ | Packaging | Tray |
| Part Status | Active | Manufacturer Lead Time | 10 Weeks |
| Mounting Type | Surface Mount | Number of I/O | 478 |
| Number of Logic Elements/Cells | 65625 | Operating Temperature | 0°C ~ 100°C (TJ) |
| Package / Case | 1024-BGA, FCBGA | Supplier Device Package | 1024-FCBGA (27x27) |
| Total RAM Bits | 3984589 | Voltage - Supply | 0.825V ~ 0.876V |
| HtsusCode | 8542.31.0060 | MoistureSensitivityLevel | 4 (72 Hours) |
| ReachStatus | REACH Unknown | RoHS Status | RoHS Compliant |
YG GROUP supports reliable sourcing through quality controls and compliance documentation. Please confirm product requirements, applicable certifications and supporting documents before ordering.
XCSU65P-2SBVA1024E is an authentic electronic component manufactured by AMD, categorized under Interface ICs. It is supplied in the standard manufacturer-specified package footprint, providing industry-standard mechanical dimensions and terminal configurations for board-level assembly. Full pinout configurations, physical footprint drawings, and rated operating tolerances are documented in the official XCSU65P-2SBVA1024E datasheet above.
Electronic component spot-market pricing for XCSU65P-2SBVA1024E fluctuates based on real-time global availability, production date codes, minimum order quantities (MOQ), and packaging formats (e.g., Reel, Tube, Tray). Using an RFQ ensures you receive accurate, real-time volume pricing tied to verified, traceable inventory rather than stale catalog estimates.
Lead times for XCSU65P-2SBVA1024E depend on whether stock is dispatched from our central hub or regional franchise partners. Ready-to-ship inventory typically leaves the warehouse within 1–3 business days following quality inspection, while factory-direct or back-ordered allocations are confirmed with an estimated ship date upon RFQ reply.
Loading articles…
Loading articles…

Choose LAN8720A-CP-TR around the MCU MAC, RMII clock direction and nINT tradeoff. Check the CP temperature rating, power connections, reset timing and four related PHY candidates.
Read more →
FFG1738 adds 40 user I/Os over the smaller LX155T package, but keeps the same 16 GTPs. Compare the bank-planning implications, internal resource limits, and four related parts before fixing the FPGA selection.
Read more →
A release image can fit in 1 MB while its recovery plan cannot. Work through STM32H743ZGT6 firmware and update budgets, separate Flash from RAM needs, and compare the 2 MB STM32H743ZIT6 before choosing the density.
Read more →
Plan XC95144XL-10TQG100I service spares after the factory deadlines. Check the exact suffix, programming assets, lot evidence and repair demand before committing to a reserve.
Read more →Loading related products…
| Picture | Part Number | Manufacturer | PDF / RoHS | Stock | Action |
|---|---|---|---|---|---|
![]() | AMD | 5,970 | |||
![]() | AMD | - | 4,080 | ||
![]() | AMD | 4,710 | |||
![]() | AMD | -- | 8,050 | ||
![]() | AMD | 9,230 | |||
![]() | AMD | 7,470 | |||
![]() | AMD | 3,030 | |||
![]() | AMD | 9,580 | |||
![]() | AMD | 5,060 | |||
![]() | AMD | 1,600 |