
| Type | Description | ||
|---|---|---|---|
| RoHS Status | RoHS Compliant | Part Life Cycle Code | Obsolete |
| Reach Compliance Code | unknown | ECCN Code | 3A991.A.2 |
| HTS Code | 8542.31.00.01 | Bit Size | 32 |
| JESD-30 Code | S-PBGA-B388 | Number of Terminals | 388 |
| Operating Temperature-Max | 85 °C | Package Body Material | PLASTIC/EPOXY |
| Package Code | BGA | Package Equivalence Code | BGA388,26X26,50 |
| Package Shape | SQUARE | Package Style | GRID ARRAY |
| Qualification Status | Not Qualified | Speed | 133 MHz |
| Supply Current-Max | 660 mA | Surface Mount | YES |
| Technology | CMOS | Temperature Grade | OTHER |
YG GROUP (YUGUANG INTERNATIONAL(HK)CO.,LTD) supports reliable sourcing through quality controls and compliance documentation. Please confirm product requirements, applicable certifications and supporting documents before ordering.
ELANSC520-133AD is an authentic electronic component manufactured by AMD, categorized under Microprocessors - MPU. It is supplied in the standard manufacturer-specified package footprint, providing industry-standard mechanical dimensions and terminal configurations for board-level assembly. Full pinout configurations, physical footprint drawings, and rated operating tolerances are documented in the official ELANSC520-133AD datasheet above.
Electronic component spot-market pricing for ELANSC520-133AD fluctuates based on real-time global availability, production date codes, minimum order quantities (MOQ), and packaging formats (e.g., Reel, Tube, Tray). Using an RFQ ensures you receive accurate, real-time volume pricing tied to verified, traceable inventory rather than stale catalog estimates.
Lead times for ELANSC520-133AD depend on whether stock is dispatched from our central hub or regional franchise partners. Ready-to-ship inventory typically leaves the warehouse within 1–3 business days following quality inspection, while factory-direct or back-ordered allocations are confirmed with an estimated ship date upon RFQ reply.
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