| Picture | Part Number | Manufacturer | Stock | Action |
|---|---|---|---|---|
 | MPF100TL-FCSG325I | Microchip | 7,360 |
Microchip lists 170 user I/Os: 84 HSIO and 86 GPIO, plus four XCVR0 serial lanes. The family-level eight transceivers and 284 user I/Os do not describe this package. Actual usable capacity depends on legal bank voltages, fixed differential pairs, clock and memory placement, dedicated functions and the rest of the design. Require the exact PPAT and a successful constrained implementation before accepting interface fit.
For PolarFire FPGA selection, L selects the lower-static-power option with STD-speed electrical performance. Build the FPGA power budget for MPF100T-FCSG325I versus MPF100TL-FCSG325I using the same temperature, supply and implementation assumptions. Do not convert a static-power claim into a guaranteed total-board saving. Core TC, data-security S and PolarFire SoC MPFS variants change other capabilities and are not equivalent suffix substitutions.
No. A family or catalogue headline is insufficient to approve 12.7 Gbps for this OPN. DS00003831G assigns L devices STD-equivalent performance; Table 5-35 gives 10.3125 Gbps maximum for STD transmit and AC-coupled receive operation. The 12.7 Gbps maximum is in the −1 column. Protocol, clock, coupling and board-channel conditions require their own checks, and DC-coupled receive limits differ.
By Carmen Lau
MPF100TL-FCSG325I is Microchip's low-static-power PolarFire FPGA, exposing 170 user I/Os and four transceiver lanes in FCSG325. Before approving its 325-ball, 0.5 mm-pitch package for a board, check bank voltages and the applicable speed grade. Logic capacity is only one constraint. A purchasing decision also needs a feasible pin assignment, a design-specific power estimate and a programming route that the engineering team can support.
MPF100TL-FCSG325I combines the MPF100 density, the lower-static-power L option, the FCSG325 package and the industrial I temperature grade. The blank speed-grade position denotes STD. The full OPN and the standard-power MPF100T-FCSG325I both appear in Microchip's official device-offering appendix; their relationship is supported by the shared electrical and packaging documents. .
No. Normal non-volatile configuration avoids the ordinary external configuration-device requirement, but an IAP recovery architecture can still use external SPI flash for a golden image. Fabric readiness also differs from completed I/O calibration and initialization of used resources. Check the actual startup/reset design, including the VDDI3 initialization requirement, rather than assuming every interface is ready immediately.
Provide the full OPN, Microchip Technology, quantity, required date, tray preference and lot or traceability-document requirements. State whether standard-power MPF100T-FCSG325I may be quoted separately for engineering review, and include any approved revision or programming constraints. Use the YG GROUP RFQ, then confirm offer-specific availability, terms and documents. A quoted substitute still needs engineering acceptance.
This is PolarFire FPGA silicon. The embedded Cortex-M3 is the internal system controller for functions such as startup, programming and system services; it is not a general application CPU supplied to the user. Do not import the hard RISC-V processor subsystem from a PolarFire SoC article into this MPF100TL BOM. Likewise, the TeraFire user cryptoprocessor belongs to the S variants, not this TL part.
For PolarFire FPGA selection, keep density, package, speed and temperature as separate approval fields. The industrial range is −40°C to +100°C junction temperature. It is not a guarantee that the board can operate at +100°C ambient while dissipating power.
Microchip lists 170 user I/Os, comprising 84 HSIO and 86 GPIO, plus four serial transceiver lanes for MPF100 in FCSG325. The same density can offer different interfaces in other packages: the family-level figures of eight transceiver lanes and 284 user I/Os must not be copied into this footprint. The package guide and product overview agree on the target package counts. Packaging and pin descriptions, product and channel tables.
Figure 1: FCSG325 exposes 170 user I/Os and four serial transceiver lanes. Match legal banks and exact constraints before approving fit, power and production requirements; this resource inventory is not a ball map. Sources: Microchip packaging guide and product overview. Compiled by YG GROUP. Evidence: documentation 1, documentation 2.
The FCSG325 pinout has HSIO banks 0 and 1, GPIO banks 2 and 4, dedicated JTAG/fixed-I/O bank 3 and XCVR0. Bank 5 in the combined diagram is marked for MPF200 only. The target body is 11 × 11 mm; the 11 × 14.5 mm FCSG325 outline belongs to the larger MPF200 device.
Treat those counts as the starting resource inventory. Differential signals use fixed P/N pairs; a bank's power and supported standards constrain which interfaces can share it. Memory and clock connections also have location rules. The following is an approval worksheet, not a completed ball assignment or a claim that all example interfaces fit simultaneously.
| Board requirement | Package resource to allocate | Evidence needed before BOM release |
|---|---|---|
| Low-voltage parallel or memory interface | Appropriate HSIO pins, lanes and reference/clock resources | Exact PPAT pin assignment and successful Libero implementation for the chosen interface |
| Higher-voltage control or peripheral interface | Suitable GPIO bank and its VDDI/VDDAUX rails | Compatible I/O standard, input/output levels and mixed-standard checks |
| Serial links | Four available XCVR0 lanes and suitable reference clocks | Lane sharing, protocol IP, board channel and speed-grade review |
| Programming and board recovery | Dedicated bank 3, JTAG/SPI/reset connections | Selected programming method, accessible test connections and reset behavior |
| Future interface margin | Uncommitted legal pins and bank capacity | Margin in the actual constraints file, rather than only a total free-pin count |
Table 1: FCSG325 interface-approval worksheet. Sources: Microchip packaging guide, pages 4 and 10–11; product overview, pages 6–7. Compiled by YG GROUP.
Require a package pin-assignment table and constraints file for the exact target. The packaging guide cautions that high-speed IOD-interface migration can vary even where package footprints are compatible. A higher-density part or a similar ball count is not an automatic way to avoid pin-planning work.
For this L device, use STD-speed specifications. The current electrical datasheet states that L devices have performance equivalent to STD devices. Table 5-35 gives a 0.25–10.3125 Gbps transmitter range and the same range for AC-coupled reception at STD speed; the 12.7 Gbps maximum belongs to the −1 column. DC-coupled receiver operation has a separate limit. A catalogue description that combines this OPN with “250Mbps–12.7Gbps” is therefore insufficient approval evidence. PolarFire electrical datasheet, overview and transceiver table.
For the selected lane rate, review reference-clock quality, clock routing, coupling, termination, connector/channel loss and protocol implementation. A maximum raw lane rate is not application payload throughput, nor proof that any supported protocol combination can be instantiated across all lanes at once.
The same discipline applies to parallel memory interfaces. Confirm the applicable STD column, I/O bank type, voltage, gearing and fabric timing. A family-level DDR capability does not establish that the desired width and rate fit this package with the rest of the board's interfaces.
For the FPGA power budget, include the core, transceiver and reference-clock supplies, I/O-bank rails and auxiliary supplies. VDD can be selected for 1.0 V or 1.05 V operation, with the corresponding limits; these are not dynamically adjustable supplies. The datasheet's recommended rail tolerances include both DC offset and ripple, measured at the package pins. A regulator's nominal output number is only part of that check.
The 0.5 mm-pitch CSP package has no on-package decoupling capacitors. Review the board decoupling and escape-routing implementation with that constraint in mind. Its compact size does not, by itself, establish a lower-cost PCB or an adequate power-delivery network.
MPF100T-FCSG325I is the useful standard-power comparison. It retains the MPF100 density, FCSG325 package and industrial grade, while omitting L. Microchip describes the L offering as lower static power with the electrical specifications of the STD-speed device. The exact OPNs are listed in the same official offering table.
| Comparison field | MPF100TL-FCSG325I | MPF100T-FCSG325I |
|---|---|---|
| Static-power option | Lower-static-power L | Standard static-power option |
| Speed for these complete OPNs | STD-equivalent L performance | STD; no −1 speed marker |
| Target package resources | FCSG325: 170 user I/Os, four transceiver lanes | Same density/package resource table |
| Engineering approval | Power estimate and implementation for the exact target | Recheck device selection, timing, power and qualification before approving a substitute |
Table 2: Low-static-power and standard-power counterpart checks. Sources: Microchip product overview, pages 32 and 34; electrical datasheet, pages 1 and 53. Compiled by YG GROUP.
The value of L depends on how much static power contributes to the actual operating profile. Dynamic fabric activity, I/O loading, transceivers and power-conversion losses do not disappear because the suffix changes. Compare both targets using the same temperature, rail mode, resource utilization, clock activity and interface assumptions. Confirm those inputs after implementation rather than treating an advertised static-power reduction as a guaranteed board-power saving.
Microchip's package compatibility guidance is useful evidence, but it is not approval of a customer-specific substitution. Keep the comparison conditional until the target, bitstream/tool settings, power and board qualification have been reviewed.
Ask engineering for a dated fit/timing report, exact constraints, power-estimator assumptions, thermal limit and selected Libero version. The FPGA's junction limit must be translated into a credible board and enclosure thermal margin using the actual activity and cooling conditions.
Startup needs its own check. Non-volatile configuration does not mean every interface is ready instantly. Fabric readiness, I/O calibration and initialization of used resources contribute to the final startup sequence. The electrical datasheet also requires VDDI3 to be powered before or with the other main supplies for initialization. Validate reset release and external-device behavior against that sequence.
Choose how production programs and verifies the board, and how field updates recover after interruption. Non-volatile operation removes the ordinary need for an external configuration device, but an IAP/golden-image recovery design can still require external SPI flash. Have engineering approve that recovery architecture before purchasing removes external flash from the BOM.
Finally, review the production errata against the selected features and silicon/tool revision. The current errata includes a suspend-mode/JTAG initialization interaction, defeatured PCIe SECDED reporting and a deprecated external VERIFY_DIGEST use with fabric POR digest checking. These are concrete review items for engineering, rather than reasons to assume every design is affected identically. PolarFire production errata.
Send YG GROUP the full OPN, Microchip Technology as manufacturer, quantity, required date and tray/lot documentation requirements. Identify whether only the approved L part is acceptable or MPF100T-FCSG325I may be quoted separately for engineering review. Include the approved package, industrial junction grade and relevant revision or programming constraints.
Confirm availability, commercial terms and required traceability documents for the actual offer. A family name, a distributor trend label or a quoted part alone does not establish interface fit. Request a quotation from YG GROUP.
